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`PATENT ABSTRACTS OF JAPAN
`
`(11)Publication number:
`(43}Date of publication of
`application :
`
`2001-102715
`13.04.2001
`
`(51}Int.ch
`
`HO5SK 1/18
`HO5SK 3/32
`
`(21 Application
`number :
`(22)Date of filing :
`
`11-277936
`
`30.09.1999
`
`:
`
`(71)
`Applicant :
`(72)
`Inventor :
`
`FUJITSU GENERAL LTD
`
`MURAMATSU NOBUTOMO
`
`(54) PART STRUCTURE FOR CONDUCTIVE ADHESIVE
`(57Abstract:
`PROBLEM TO BE SOLVED: To provide a part structure
`for conductive adhesive, in which no short circuit
`between both electrodes occurs, even if a conductive
`adhesive flows out.
`SOLUTION: Since the thicknesses of at least the lower
`surfaces of electrodes 3 are made larger than a
`prescribed thickness which is set at such a size that can
`sufficiently accommodate a conductive adhesive 12
`flowing out from the lands 11 of a circuit board 20 to
`spaces 4 formed between a main body (base substrate)
`1 and the electrodes 3, occurrence of such a case can be
`prevented that the adhesive 12 flowing in the space
`between both electrodes 3 in a heating step is stuck to
`both electrodes 3 and both lands 11 by surface tension
`
`and short-circuits the electrodes 3 to each other.
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