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METHODS OF MAKING COMPLIANT SEMICONDUCTOR CHIP PACKAGES

12/587,714 | U.S. Patent Application

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Location ELECTRONIC
Filed Oct. 13, 2009
Examiner DAVID E GRAYBILL
Class 257
Art Group 2894
Patent No. 8,558,386
Case Type Utility - 257/774000
Status Patent Expired Due to NonPayment of Maintenance Fees Under 37 CFR 1.362
Parent 09/20,647 Abandoned
Parent 08/739,303 Patented
Parent 60/7,128 Expired
Child 14/35,475 Abandoned
Child 14/662,579 Abandoned
Last Updated: 7 months ago
Date # Transaction