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METHOD AND APPARATUS FOR PLASMA DICING A SEMI-CONDUCTOR WAFER

13/448,769 | U.S. Patent Application

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Location ELECTRONIC

Filed April 17, 2012

Examiner ERIK T PETERSON

Class 438

Art Group 2822

Patent No. 8,778,806

Case Type Utility - 438/464000

Status Patented Case

Parent 13/412,119 Patented

Parent 61/452,450 Expired

Last Updated: 3 years, 11 months ago

Date	#	Transaction
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METHOD AND APPARATUS FOR PLASMA DICING A SEMI-CONDUCTOR WAFER

13/448,769 | U.S. Patent Application

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