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THERMALLY ENHANCED SEMICONDUCTOR ASSEMBLY WITH EMBEDDED SEMICONDUCTOR DEVICE AND BUILT-IN STOPPER AND METHOD OF MAKING THE SAME

13/753,589 | U.S. Patent Application

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Location ELECTRONIC
Filed Jan. 30, 2013
Examiner DAVID A ZARNEKE
Class 257
Art Group 2891
Case Type Utility - 257/774000
Status Abandoned -- Failure to Respond to an Office Action
Parent 61/682,801 Expired
Parent 13/733,226 Abandoned
Parent 13/738,314 Patented
Child 13/969,641 Abandoned
Child 14/43,933 Abandoned
Child 14/53,950 Patented
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Last Updated: 4 years, 2 months ago
Date # Transaction