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Method and Apparatus for Plasma Dicing a Semi-conductor Wafer

13/764,177 | U.S. Patent Application

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Location ELECTRONIC

Filed Feb. 11, 2013

Examiner ERIK T PETERSON

Class 438

Art Group 2822

Patent No. 9,202,720

Case Type Utility - 438/464000

Status Patented Case

Parent 13/412,119 Patented

Child 14/842,365 Patented

Child 14/974,840 Patented

Child 16/132,040 Patented

Last Updated: 3 months, 3 weeks ago

Date	#	Transaction
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Method and Apparatus for Plasma Dicing a Semi-conductor Wafer

13/764,177 | U.S. Patent Application

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