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SEMICONDUCTOR ASSEMBLY WITH DUAL CONNECTING CHANNELS BETWEEN INTERPOSER AND CORELESS SUBSTRATE

13/917,776 | U.S. Patent Application

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Location ELECTRONIC
Filed June 14, 2013
Examiner JAMES WU
Class 174
Art Group 2835
Case Type Utility - 174/262000
Status Abandoned -- Failure to Respond to an Office Action
Parent 13/615,819 Patented
Parent 13/753,625 Abandoned
Parent 13/615,819 Patented
Parent 61/682,801 Expired
Parent 61/682,801 Expired
Last Updated: 2 years, 3 months ago
Date # Transaction