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METHOD AND APPARATUS FOR PLASMA DICING A SEMI-CONDUCTOR WAFER

13/764,160 | U.S. Patent Application

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Filed Feb. 11, 2013
Examiner PETERSON, ERIK T
Class 438
Art Group 2822
Patent No. 8,980,764
Case Type Utility
Status Patented Case
Last Updated: 3 months, 3 weeks ago
Date # Transaction