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Method and Apparatus for Plasma Dicing a Semi-conductor Wafer

14/14,040 | U.S. Patent Application

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Location ELECTRONIC
Filed Aug. 29, 2013
Examiner ERIK T PETERSON
Class 438
Art Group 2822
Patent No. 9,343,365
Case Type Utility - 438/460000
Status Patented Case
Parent 13/787,032 Patented
Parent 13/767,459 Patented
Parent 13/412,119 Patented
Parent 13/412,119 Patented
Parent 61/452,450 Expired
Child 14/201,409 Patented
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Last Updated: 4 years, 6 months ago
Date # Transaction