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Method and Apparatus for Plasma Dicing a Semi-conductor Wafer

14/176,747 | U.S. Patent Application

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Location ELECTRONIC

Filed Feb. 10, 2014

Examiner ERIK T PETERSON

Class 438

Art Group 2822

Patent No. 9,202,721

Case Type Utility - 438/731000

Status Patented Case

Parent 13/829,324 Patented

Parent 13/412,119 Patented

Parent 61/452,450 Expired

Last Updated: 4 years, 4 months ago

Date	#	Transaction
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Method and Apparatus for Plasma Dicing a Semi-conductor Wafer

14/176,747 | U.S. Patent Application

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