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THERMALLY ENHANCED SEMICONDUCTOR ASSEMBLY WITH EMBEDDED CHIP AND INTERPOSER AND METHOD OF MANUFACTURING THE SAME

14/190,457 | U.S. Patent Application

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Location ELECTRONIC
Filed Feb. 26, 2014
Examiner AZM A PARVEZ
Class 029
Art Group 3729
Case Type Utility - 029/840000
Status Abandoned -- Failure to Respond to an Office Action
Parent 13/615,819 Patented
Parent 13/753,625 Abandoned
Parent 61/895,506 Expired
Parent 13/615,819 Patented
Parent 61/682,801 Expired
Parent 61/682,801 Expired
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Last Updated: 5 years, 6 months ago
Date # Transaction