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Method and Apparatus for Plasma Dicing a Semi-conductor Wafer

14/842,365 | U.S. Patent Application

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Location ELECTRONIC
Filed Sept. 1, 2015
Examiner ERIK T PETERSON
Class 438
Art Group 2822
Patent No. 10,297,427
Case Type Utility - 438/464000
Status Patented Case
Parent 13/764,177 Patented
Parent 13/412,119 Patented
Parent 61/452,450 Expired
Child 14/974,840 Patented
Child 16/132,040 Pending
Last Updated: 4 years, 6 months ago
Date # Transaction