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Method and Apparatus for Plasma Dicing a Semi-conductor Wafer

14/854,127 | U.S. Patent Application

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Location ELECTRONIC

Filed Sept. 15, 2015

Examiner JAMES A MENEFEE

Class 438

Art Group 3992

Patent No. RE46339

Case Type Re-Issue - 438/464000

Status Patented Case

Parent 13/767,459 Patented

Parent 13/412,119 Patented

Parent 61/452,450 Expired

Last Updated: 4 years, 9 months ago

Date	#	Transaction
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Method and Apparatus for Plasma Dicing a Semi-conductor Wafer

14/854,127 | U.S. Patent Application

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