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METHOD AND APPARATUS FOR PLASMA DICING A SEMI-CONDUCTOR WAFER

14/974,840 | U.S. Patent Application

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Location ELECTRONIC

Filed Dec. 18, 2015

Examiner ERIK T PETERSON

Class 438

Art Group 2822

Patent No. 9,564,366

Case Type Utility - 438/464000

Status Patented Case

Parent 14/842,365 Patented

Parent 13/764,177 Patented

Parent 13/412,119 Patented

Parent 61/452,450 Expired

Last Updated: 4 years, 3 months ago

Date	#	Transaction
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METHOD AND APPARATUS FOR PLASMA DICING A SEMI-CONDUCTOR WAFER

14/974,840 | U.S. Patent Application

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