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Method and Apparatus for Plasma Dicing a Semi-conductor Wafer

15/287,412 | U.S. Patent Application

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Location ELECTRONIC
Filed Oct. 6, 2016
Examiner ERIK T PETERSON
Class 438
Art Group 2822
Patent No. 9,911,654
Case Type Utility - 438/460000
Status Patented Case
Parent 14/721,443 Patented
Parent 13/787,032 Patented
Parent 13/767,459 Patented
Parent 13/412,119 Patented
Parent 61/452,450 Expired
Child 15/910,561 Pending
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Last Updated: 6 years, 2 months ago
Date # Transaction