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FLIP-CHIP PACKAGE WITH PROTECTIVE LAYER FOR ELECTROMAGNETIC NOISE REDUCTION

15/765,184 | U.S. Patent Application

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Location ELECTRONIC
Filed March 30, 2018
Examiner SHIH TSUN A CHOU
Class 257
Art Group 2811
Case Type Utility - 257/659000
Status Abandoned -- Failure to Respond to an Office Action
Parent PCT/JP2016/079997 Published
Child 2015-202137
Last Updated: 3 years, 3 months ago
Date # Transaction