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Method and Apparatus for Plasma Dicing a Semi-conductor Wafer

15/910,561 | U.S. Patent Application

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Location ELECTRONIC
Filed March 2, 2018
Examiner MARY A WILCZEWSKI
Class 438
Art Group 2822
Patent No. 10,741,447
Case Type Utility - 438/460000
Status Patented Case
Parent 15/287,412 Patented
Parent 14/721,443 Patented
Parent 13/787,032 Patented
Parent 13/767,459 Patented
Parent 13/412,119 Patented
Parent 61/452,450 Expired
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Last Updated: 1 year, 3 months ago
Date # Transaction