Attorney Docket No. 0210-152001
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`MULTI-AXIS ULTRASONIC WEDGE WIRE
`BONDING
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`[0001]
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`This documentrelates to wedge wire bonding.
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`TECHNICAL FIELD
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`BACKGROUND
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`[0002]
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`In recent years, the world has beguna transition away from using powerprimarily
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`obtained from fossil fuels and toward more sustainable energy sources. One area wherethis
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`changeoccurs involvesthe use of electric motors powered by on-board energy storages in
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`vehicles. Vehicle makers are striving to increase efficiency and utility of such vehicles, including
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`the performance of energy storages such as battery packs, which includes improving the quality
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`of wedge wire bondsused to electrically interconnect components of such battery packs, such as
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`terminals of electrochemical cells and busbars.
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`SUMMARY
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`[0003]
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`In a general aspect, an electrical device assembly (e.g., a battery module) can
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`includea first electrical contact surface, a second electrical contact surface, and a ribbon wire
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`extending along a longitudinal axis. The ribbon wire can include a first portion that is coupled
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`with the first electrical contact surface via a first wedge bond. The ribbon wire can also include a
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`second portion that is coupled with the second electrical contact surface via a second wedge
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`bond. The ribbon wire can further include a third portion extending betweenthefirst portion and
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`the second portion. Thefirst portion of the ribbon wire can havea first width transverse to the
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`longitudinal axis of the ribbon wire, and the third portion of the ribbon wire having a second
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`width transverse to the longitudinal axis, the first width being greater than the second width.
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`[0004]
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`Implementations can include one or more of the following features. For example,
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`the second portion of the ribbon wire hasa third width transverse to the longitudinal axis of the
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`ribbon wire, the third width being approximately equal to the second width.
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`[0005]
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`The second portion of the ribbon wire can havea third width transverse to the
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`longitudinal axis of the ribbon wire, the third width being approximately equal to the first width.
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`[0006]
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`Intermetallics of the first wedge bond onthefirst electrical contact surface can be,
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`at least in part, circular. Intermetallics of the second wedge bond onthe secondelectrical contact
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`surface can be,at least in part, circular.
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`Attorney Docket No. 0210-152001
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`[0007]
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`Thefirst electrical contact surface and the secondelectrical contact surface can
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`each be respectively included in one of a busbar of a battery module, or in a terminal located at
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`an end of an electrochemicalcell of the battery module. The terminal of the electrochemical cell
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`can include one of a rim or a cap ofthe electrochemical cell. The ribbon wire can include a
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`copper ribbon wire.
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`[0008]
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`In another general aspect, an electrical device assembly(e.g., a battery module)
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`can include an electrical contact surface, and a ribbon wire including a portion that is coupled
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`with the electrical contact surface via a wedge bond. Intermetallics of the wedge bond on the
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`electrical contact surface can define, at least in part, concentric circular patterns.
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`[0009]
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`Implementations can include one or more of the following features. For example,
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`the portion of the ribbon wire can be a first portion of the ribbon wire. The ribbon wire can
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`extend along a longitudinal axis. The ribbon wire can include a second portion forming a wire
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`loop. Thefirst portion of the ribbon wire and the second portion of the ribbon wire can be
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`electrically continuous. Thefirst portion of the ribbon wire can havea first width transverse to
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`the longitudinal axis of the ribbon wire. The second portion of the ribbon wire can have a second
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`width transverse to the longitudinal axis of the ribbon wire,the first width being greater than the
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`second width.
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`[0010]
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`The electrical contact surface can be included in one of a busbarofa battery
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`module, or in a terminal located at an end of an electrochemical cell of the battery module. The
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`terminal of the electrochemical cell can include one of a mm or a cap of the electrochemicalcell.
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`The ribbon wire can include a copper ribbon wire.
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`[0011]
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`In another general aspect, a method can include feeding a ribbon wire through a
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`wedge bonderhead, and positioning the wedge bonder headoveran electrical contact surface,
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`the electrical contact surface being arranged in a plane. The methodcan further include lowering
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`the wedge bonder head, such thatafirst surface of the ribbon wireis in contact with the electrical
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`contact surface and such that a wedge of the wedge bonderheadis in contact with a second
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`surface of the ribbon wire opposite the first surface of the ribbon wire. The method can also
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`include forming a wedge bond between the ribbon wire and the electrical contact surface.
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`Forming the wedge bond can include activating an ultrasonic transducer of the wedge bonder
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`head with the wedge in contact with the ribbon wire, and rotating the wedge bonder head with
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`the wedge in contact with the ribbon wire.
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`Attorney Docket No. 0210-152001
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`[0012]
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`Implementations can include one or more of the following features. For example,
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`activating the ultrasonic transducer can include activating the ultrasonic transducer whenrotating
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`the wedge bonder head.
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`[0013]
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`Activating the ultrasonic transducer can include activating a plurality of ultrasonic
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`transducers. A first ultrasonic transducerof the plurality of ultrasonic transducers can have an
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`ultrasonic vibration axis that is parallel to the plane of the electrical contact surface, and a second
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`ultrasonic transducer can have an ultrasonic vibration axis that is perpendicular to the plane of
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`the electrical contact surface. A third ultrasonic transducerof the plurality of ultrasonic
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`transducers can have an ultrasonic vibration axis that is parallel to the plane of the electrical
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`contact surface and perpendicularto the ultrasonic vibration axis of the first ultrasonic
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`transducer.
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`[0014]
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`A first ultrasonic transducer of the plurality of ultrasonic transducers can have an
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`ultrasonic vibration axis that is parallel to the plane of the electrical contact surface, and a second
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`ultrasonic transducerof the plurality of ultrasonic transducers can have an ultrasonic vibration
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`axis that is parallel to the plane of the electrical contact surface and non-parallel with the
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`ultrasonic vibration axis of the first ultrasonic transducer. A third ultrasonic transducer of the
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`plurality of ultrasonic transducers can have an ultrasonic vibration axis that is perpendicular to
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`the plane ofthe electrical contact surface.
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`[0015]
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`A first ultrasonic transducer of the plurality of ultrasonic transducers can have an
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`ultrasonic vibration axis that is parallel to the plane of the electrical contact surface, and a second
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`ultrasonic transducerof the plurality of ultrasonic transducers can have an ultrasonic vibration
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`axis that is parallel to the plane of the electrical contact surface and parallel with the ultrasonic
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`vibration axis of the first ultrasonic transducer. A third ultrasonic transducerofthe plurality of
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`ultrasonic transducers can have an ultrasonic vibration axis that is perpendicular to the plane of
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`the electrical contact surface.
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`BRIEF DESCRIPTION OF DRAWINGS
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`[0016]
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`[0017]
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`FIG. 1 is a block diagram illustrating an example wedge wire bonder.
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`FIG. 2 is a diagram illustrating an example of formation of a wire bond using
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`multi-axis ultrasonic wedge bonding, such as using the wedge wire bonderillustrated in FIG. 1.
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`[0018]
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`FIGs. 3A-3B are diagrams schematically illustrating example wedge bonded
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`Attorney Docket No. 0210-152001
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`ribbon wires including wedge bonds formed using multi-axis ultrasonic wedge bonding.
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`[0019]
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`FIGs. 4A-4C are diagrams schematically illustrating example battery modules that
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`include wedge bondedribbon wires having wedge wire bonds formed using multi-axis ultrasonic
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`wedge bonding implemented in respective battery modules.
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`[0020]
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`FIG. 5 is a diagram illustrating an example wedge bonder head for forming wedge
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`wire bonds using multi-axis ultrasonic wedge bonding.
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`[0021]
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`FIG. 6 is a diagram schematically illustrating example ultrasonic transducer
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`arrangement.
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`[0022]
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`[0023]
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`FIG.7 is flowchart illustrating an example method.
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`Like reference symbols in the various drawingsindicate like elements.
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`DETAILED DESCRIPTION
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`[0024]
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`This document describes examples of systems and techniquesdirected to
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`formation of a wedge wire bondusing ultrasonic vibration along multiple axes, which can be
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`referred to as multi-axis ultrasonic wedge bonding, or wedge bonding using multi-axis
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`ultrasonics. In some implementations, forming a wedge wire bond can include, during formation
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`of the bond, rotating a wire bonder head in conjunction with (e.g., contemporaneously with)
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`activation of one or more ultrasonic transducers included in the wire bonder head. The subject
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`matter described herein can improvethe performance of corresponding electrical device
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`assemblies, such as battery modules. For example, electrical interconnects to individual electrical
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`contact surfaces (e.g., terminals of electrochemical cells and/or busbars of a battery module) can
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`be provided with increased conductivity as a result of electrical resistance of associated wedge
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`wire bonds being reduced. Such reducedresistance can be achievedas a result of increased bond
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`area and/or due to improved adherence of bond wire material to a correspondingelectrical
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`contact surface, such as a busbaror a terminal of an electrochemicalcell of a battery module.
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`Stated another way, wedge wire bonds formedusing the approaches described herein can have
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`larger bond (e.g., contact) areas, and/or lower resistance per unit area than wedge wire bonds
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`formed using current approaches.
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`[0025] Examples herein refer to forming wedge wire bonds using multi-axis ultrasonics to
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`adhere, or ultrasonically weld a bond wire (e.g., a ribbon wire) to a corresponding electrical
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`contact surface. As used herein, multi-axis ultrasonics can include in-plane ultrasonics and/or
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`out-of-plane ultrasonics. In-plane ultrasonics can be implemented by ultrasonic transducers with
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`Attorney Docket No. 0210-152001
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`vibration axes that are parallel with, and/or in-plane with an electrical contact surface on which a
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`wedgewire bond is formed. Out-of-plane ultrasonics can be implemented by ultrasonic
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`transducers with vibration axes that are non-parallel with (e.g., perpendicular to, or at a non-zero
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`angle with) an electrical contact surface on which a corresponding wedgewire bond is formed.
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`In example implementations, ultrasonic transducers with vibration frequencies in a range of 40
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`kHz and 160 kHz can be used.
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`[0026]
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`Examples herein refer to bond wires (e.g., ribbon wires) that extend along
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`respective longitudinal axes. As used herein, a bond wire can have any numberofdifferent
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`geometries, can include one or more materials having respective conductivities. For instance, a
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`bond wire can be a multi-layered bond wire that has a plurality of layer each having a respective
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`conductivity. In some implementations, a bond wire can be a ribbon wire having a rectangular
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`cross-section and having one or more layers, which can include one or more conductive
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`materials, such as copper, aluminum,alloys of copper, alloys of aluminum, etc. As used herein, a
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`longitudinal axis of a bond wire can be defined as being a mid-line of the bond wire that extends
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`along a length of the bond wire. For instance, when a give bond wireis in a flat and linear
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`configuration, its longitudinal axis, or mid-line will be a straight line. However, when the bond
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`wire is in a non-flat and/or non-linear configuration (e.g., a curved or arced) configuration, the
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`longitudinal axis, or mid-line will conform to the configuration or shape of the bond wire and,
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`therefore, may not be situated along a straight line.
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`[0027]
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`Examples herein refer to intermetallics of wedge bondsthat are, at least in part,
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`circular. As used herein, intermetallics are metallic compoundsthat are formedas a result of
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`ultrasonic scrubbing of a bond wire on anelectrical contact surface. As used herein, circular
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`meanscurved in shape and can include concentric curved orcircular patterns, partial curved or
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`circular patterns, and so forth that can be observed on an upper surface of a bond wire in a wire
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`bondand/or observed in intermetallics formed between a bond wire and a corresponding,
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`underlying electrical contact surface. Accordingly, such intermetallics can be intermetallics
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`having patterns on an electrical contact surface thatare, at least in part, circular or curved in
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`shape.
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`[0028]
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`Examples herein refer to wire loops. As used herein, a wire loop is a portion of a
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`ribbon wire that extends between two wedge wire bonds. Forinstance, a wire loop can
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`electrically connect a first wedge wire bond andits corresponding electrical contact surface with
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`Attorney Docket No. 0210-152001
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`a second wedge wire bondandit correspondingelectrical contact surface. In implementations, a
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`wire loop can be flat, curved, arced, or a combination thereof.
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`[0029]
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`Examples herein refer to electrochemical cells. As used herein, an electrochemical
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`cell is a device that generates electrical energy from chemical reactions, or uses electrical energy
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`to cause chemical reactions, or both. An electrochemical cell can include an electrolyte and two
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`electrodes to store energy and deliver it when used. In some implementations, the
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`electrochemical cell can be a rechargeable cell. For example, the electrochemical cell can be a
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`lithium-ion cell. In some implementations, the electrochemical cell can act as a galvanic cell
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`whenbeing discharged, and as an electrolytic cell when being charged. The electrochemicalcell
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`can haveat least one terminal for each of the electrodes. The terminals, or at least a portion
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`thereof, can be positioned at one end ofthe electrolytic cell. For example, when the
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`electrochemical cell has a cylindrical shape, one of the terminals can be providedin the center of
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`the end ofthe cell, and the can that forms the cylinder can constitute the other terminal and
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`therefore be present at the end as well. Other shapes of electrochemical cells can be used,
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`including, but not limited to, prismatic shapes.
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`[0030]
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`Examples herein refer to a battery module, which is an individual component
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`configured for holding and managing multiple electrochemical cells during charging, storage,
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`and use. The battery module can be intended as the sole power source for one or more loads
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`(e.g., electric motors), or more than one battery module of the same or different type can be used.
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`Two or more battery modules can be implemented in a system separately or as part of a larger
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`energy storage unit. For example, a battery pack can include two or more battery modules of the
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`same or different type. A battery module can include control circuitry for managing the charging,
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`storage, and/or use of electrical energy in the electrochemicalcells, or the battery module can be
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`controlled by an external component. For example, a battery management system can be
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`implemented on one or morecircuit boards(e.g., a printed circuit board).
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`[0031]
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`Examples herein refer to a busbar, where a corresponding battery module can
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`have at least one busbar. The busbaris electrically conductive and is used for conducting
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`electricity to the electrochemical cells when charging, or from the cells when discharging. The
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`busbar is madeofan electrically conductive material (e.g., metal) and has suitable dimensions
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`considering the characteristics of the electrochemical cells and the intended use. In some
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`implementations, the busbar comprises aluminum (e.g., an aluminum alloy). A busbar can be
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`Attorney Docket No. 0210-152001
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`planar(e.g., flat) or can have one or more bends, depending on the shape and intendeduse of the
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`battery module.
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`[0032]
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`Examples herein may refer to a top or a bottom. These and similar expressions
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`identify things or aspects in a relative way based on an expressor arbitrary notion of perspective.
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`That is, these terms are illustrative only, used for purposes of explanation, and do not necessarily
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`indicate the only possible position, direction, and so on.
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`[0033]
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`FIG. 1 is a block diagram illustrating an example wedge wire bonder (wire
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`bonder) 100. The wire bonder 100 can be used to form wedge wire bonds using multi-axis
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`ultrasonics, such as using the approaches described herein. Wire bonder 100 is given by way of
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`example, and wire bonders having other configurations can be used to form wedge wire bonds
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`using multi-axis ultrasonics in accordance with the present disclosure. As shownin FIG.1, the
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`wire bonder 100 includes a wedge bonderhead 102, a rotary motor 104, a wire feed (or wire
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`supply) device 106, one or morein-plane (e.g., X-Y plane) ultrasonic transducers 108, and one or
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`more orthogonal or out-of-plane (e.g., Z-axis) ultrasonic transducers 110.
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`[0034]
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`In this example, the rotary motor 104 can be used to rotate the wedge bonder head
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`102 both during formation of wedge wire bonds, as well as to orient the bonder to move between
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`bondingsites, e.g., to properly feed the ribbon wire to form interconnecting wire loops between
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`wedge wire bonds. In example implementations, the rotary motor 104 can be a stepper motor, a
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`servo motor, and/or other motor for which an angle of rotation can be controlled, such as by a
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`programable control device, such as a microprocessor or microcontroller. For instance, the rotary
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`motor 104 can selectably (e.g., programmably) rotate in a clockwise direction and/or a counter-
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`clockwise direction, such as shown, for example, in FIG. 2. The wire feed 106 of the wire bonder
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`100 can supply wire, e.g., ribbon wire from a wire spool supply, through the wire guide of the
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`wedge bonder head 102, such that the wire is fed under the wedgeto position the wire for
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`formation of a wedge bond.
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`[0035]
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`In the example wire bonder 100, the one or more in-plane transducers 108 can be
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`included in, or coupled with the wedge bonder head 102, so as to provide ultrasonic vibration of
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`the wedge of the wedge bonder head 102 along respective axesthat are parallel with, or in-plane
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`with a plane defined by an electrical contact surface on which a wedge wire bondis being
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`formed. The one or more orthogonal or out-of-plane transducers 110 can also be includedin, or
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`coupled with the wedge bonder head 102. In comparison to the one more in-plane transducers
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`Attorney Docket No. 0210-152001
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`108, the one or more orthogonal, or out-of-plane transducers 110 can provide ultrasonic vibration
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`along respective axes that are non-parallel with the plane of an electrical contact surface on
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`which a wedge bond1s being formed, such as axes that are orthogonalto, or at non-zero angles
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`with the plane of the electrical contact surface.
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`[0036]
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`FIG. 2 is a diagram illustrating an example of a wire bond operation 200 for
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`formation of a wedge wire bond using multi-axis ultrasonics, such as using the wedge wire
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`bonder 100 illustrated in FIG. 1. Accordingly, FIG. 2, for purposes of example andillustration,
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`will be described with further reference to FIG. 1. However, in some implementations, wire
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`bonders having other configurations can be used to form wedge wire bonds using multi-axis
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`ultrasonics. In this example, a wedge of the wire bonder 100 is schematically shown in FIG. 2 as
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`wedge 100a. FIG. 2 alsoillustrates a ribbon bond wire (ribbon wire, or wire) 202, which is
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`shown in a side view from an endof the ribbon wire 202, and a portion of a electrochemicalcell
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`210 that can be included in a battery module. X , Y and Z axesare also shownin FIG.2 for
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`reference in the discussion of the bonding operation 200. Also shown in FIG.2 are arrows 204
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`and 206 indicating, respectively, clockwise rotation of the wedge 100a (or associated wedge
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`bonder head) and counterclockwise rotation of the wedge 100a.
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`[0037]
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`In example implementations, the ribbon wire 202 can be shaped(e.g., as a result
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`of forming wire bondsand associated wire loops) to be suitable forits intended use of forming
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`electrical connection between separate electric contact surfaces, which can also be referred to as
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`conductive surfaces. That is, in some implementations, the ribbon wire 202 can be used to form
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`an electrical connection between separate conductive surfaces with a wedge wire bondonatleast
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`one of the conductive surfaces being formed using multi-axis ultrasonics. In implementations,
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`the conductive surfaces can be substantially parallel to each other (e.g., co-planar or in parallel
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`planes), or the conductive surfaces can be oriented in different directions. As another example,
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`the conductive surfaces can be positioned at substantially a same level relative to a reference
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`level (e.g., co-planar), or the conductive surfaces can be positionedat different levels relative to
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`the reference level (e.g., non-co-planar).
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`[0038]
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`In some implementations, the shape of the ribbon bond wire 202 can result from
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`the process by whichthe ribbon wire 202is installed to electrically connect the associated
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`conductive surfaces. For example, the ribbon wire 202 caninitially be kept as stock material on a
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`spool, and a suitable length of the ribbon wire 202 can be installed to form an electrical
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`Attorney Docket No. 0210-152001
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`connection between two or more conductive surfaces, thereby assuming a shape suitable for
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`connecting those surfaces, e.g., such as including an appropriate wire loop (or wire loops)
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`between respective wedge bonds formed on the conductive surfaces. Depending on the particular
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`implementation, the ribbon wire 202 can include copper, aluminum, a copperalloy, an aluminum
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`alloy, and/or a combination thereof. In some implementations, the ribbon wire 202 can be a
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`multi-layered ribbon wire that includes layers of different material that are bonded to each other
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`(e.g., laminated, swaged, adhesive attached, etc.).
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`[0039]
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`In the example of FIG. 2, the bonding operation 200 involveselectrically bonding
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`the ribbon wire 202 to a portion of an electrochemical cell 208 of a battery module. Here, only an
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`end 210 of the electrochemical cell 208 is shown for simplicity. In some implementations, the
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`end 210 can be referred to as a top of the electrochemical cell 208. For example, the
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`electrochemical cell 208 can include a can (not shown)to hold active materials, and the end 210
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`can be formed by a cap that seals an opening ofthe can.
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`[0040]
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`The electrochemical cell 208 can have multiple terminals. Here, a terminal 212 is
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`shownasa Structure positioned at a center of the end 210. For example, the terminal 212 can be
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`a positive terminal of the electrochemical cell 208. Here, a rim 214 includedin the end 210 is at
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`least a part of another terminal of the electrochemical cell 208. For example, the rim 214 (and a
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`remainder of the can material, including a bottom of the can) may serve as a negative terminal of
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`the electrochemical cell 208. In such approaches, the terminal 212 and the rim 214 can be
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`electrically insulated from one another.
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`[0041]
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`The bonding operation 200 can include use of one or more tools. In some
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`implementations, such as those described herein, a wire bonding head can be used, such as the
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`wedge bonder head 102 of the wire bonder 100 (FIG. 1). As noted above, the wire bonding head
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`can include the wedge 100a. The wedge 100a can be used to bond the ribbon wire 200 to the
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`terminal 212, or the rim 214. In this example, formation of a wedge wire bondto the terminal
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`212 is illustrated. In implementations, the wedge 100a can be madeof metal. In some
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`implementations, the wedge 100a(e.g., using the one or more in-plane transducers 108 and/or
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`the one or more out-of-plane transducers 110, as shown in FIG. 1) can apply multi-axis
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`ultrasonic vibrations to the ribbon wire 202, such that the ribbon wire 202 bonds(e.g.,
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`ultrasonically welds to form intermetallics) with material of the terminal 212. For example, the
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`terminal 212 can include steel or another metal.
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`Attorney Docket No. 0210-152001
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`[0042]
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`In some implementations, the ribbon wire 202 can be wedge bondedto the rim
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`214 of the electrochemical cell 208. In such implementations, the ribbon wire can have any
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`appropriate orientation relative to the rim 214. For instance, in some implementations, the
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`orientation of the ribbon wire 202 (e.g., a longitudinal axis or mid-line of the ribbon wire 202)
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`can be substantially radial relative to the rim 214. In other implementations, the ribbon wire 202
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`can be oriented substantially in a tangential direction relative to the rim 214. In still other
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`implementations, other orientations of the ribbon wire 202 relative to the rim 214 can be used.
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`[0043]
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`As shown in FIG.2, in this example, a bottom (first) surface of the ribbon wire
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`202 is in contact with the terminal 212, while the wedge 100a of the wedge bonder head 102 is in
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`contact with a top (second) surface of the ribbon wire 202, with wedge 100a applying an
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`appropriate amountofpressure, e.g., along the Y-axis, to the ribbon wire 202. The amountof
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`pressure applied to the ribbon wire 202 by the wedge 100a will depend on the particular
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`implementation.
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`[0044]
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`In the bonding operation 200 shownin FIG.2, with the first surface of the ribbon
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`wire 202 in contact with the terminal 212, and with the wedge 100a in contact with the second
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`surface of the ribbon wire 202, the one or more in-plane transducers 108 (FIG. 1) and/or the one
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`or more out-of-plane transducers 110 (FIG. 1) can be activated. Further in the bonding operation
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`200, while the one or more in-plane transducers 108 and/or the one or more out-of-plane
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`transducers 110 (FIG. 1) are activated, the wedge 100a(e.g., along with the corresponding
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`wedge bonder head 102 of FIG. 1) can be rotated, using the rotary motor 104 (FIG.1),
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`clockwise, as indicated by the arrow 204, and/or can be rotated counter-clockwise, as indicated
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`by the arrow 206.
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`[0045]
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`In such an approach the one or more in-plane transducers 108 (FIG. 1) can
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`provide ultrasonic vibration of the wedge 100a in the X-Y plane indicated by the reference X-Y-
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`Z axes in FIG. 2 (e.g., parallel to, or in plane with the surface of the terminal 214). Further, in
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`such implementations, the one or more out-of-plane transducers 110 (FIG. 1) can provide
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`ultrasonic vibration of the wedge 100a along the Z-axis (e.g., perpendicular to the surface of the
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`terminal 214), or along an axis that is at a non-zero angle (e.g., not parallel) with the surface of
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`the terminal 214.
`
`[0046]
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`In some implementations, the wedge 100a can be rotated while the one or more
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`in-plane transducers 108 and/or the one or more out-of-plane transducers 110 (FIG. 1) are
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`activated. In other implementations, the one or more in-plane transducers 108 and/or the one or
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`more out-of-plane transducers 110 can be activated with the wedge 100ainafirst position, then
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`Attorney Docket No. 0210-152001
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`deactivated while with wedge 100ais rotated andstill in contact with the ribbon wire 202 as
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`shownin FIG.2, and then reactivated with the wedge 100a in a second,rotated position. This
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`process can then be repeated for additional positions of the wedge 100a. In still other
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`implementations, the one or more in-plane transducers 108 and/or the one or more out-of-plane
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`transducers 110 can be activated and deactivated in sequence, either while the wedge 100ais
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`being rotated, and/or while the wedge 100ais stationary in different positions. The particular
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`combination of rotation of the wedge 100a and activation of the one or more in-plane transducers
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`108 and/or the one or more out-of-plane transducers 110 will depend on the particular
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`implementation.
`
`[0047]
`
`FIGs. 3A and 3B are diagrams schematically illustrating example wedge bonded
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`ribbon wires including wedge bonds formed using multi-axis ultrasonics in accordance with the
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`present disclosure. For clarity and simplicity, corresponding, underlying electrical contact
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`surfaces on which the wedge bondsof FIGs. 3A and 3B can be formed are not shown in FIGs.
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`3A and 3B. As described herein, such electrical contact surfaces can be respectively part of(e.g.,
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`included in) a busbar, or part of a terminal or an electrochemicalcell. In other implementations,
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`wedge bonds formed with multi-axis ultrasonics using the approaches described herein can be
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`formed with other electrical contact surfaces.
`
`[0048]
`
`Referring to FIG. 3A, a ribbon wire 300 is illustrated, where the ribbon wire 300
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`includes a portion 302a, a portion 302b anda portion 302c. As shownin FIG. 3A,the ribbon
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`wire 300 can generally extend along a longitudinal axis L. In the example of FIG. 3A, the portion
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`302a of the ribbon wire 300 can be coupled with a corresponding, underlying conductive surface
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`315 with a wedge bond 310, while the portion 302b can be coupled with a corresponding,
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`underlying conductive surface 320 with a wedge bond 320 (e.g., such as in an arrangement
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`similar to the ribbon wire 206 and the terminal 212 in FIG. 2). In the example of FIG. 3A, the
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`wedge bond 310 of the portion 302a is formed using the approachesdescribed herein for forming
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`wedge bondsusing multi-axis ultrasonics, including rotation of a wire bonding wedge. In
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`contrast, the wedge bond 320 of the portion 302b is formed withoutrotation of a wire bonding
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`wedge. In some implementations, both in-plane and out-of-plane transducers can be used to form
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`the wedge bond 320.
`
`-ll-
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`

`

`Attorney Docket No. 0210-152001
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`[0049]
`
`In the example of FIG. 3A,intermetallics 312 (e.g., a pattern of intermetallics
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`formed between the ribbon wire 300 and a corresponding conductive surface) of the wedge bond
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`310 are schematically illustrated. The dashedline of the wedge bond 310,as illustrated in FIG.
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`3A, can indicate an outer perimeter of the wedge bond 310. As shownin FIG.3A, the
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`intermetallics 312 are, at least in part, circular. That is, the intermetallics 312 formed between the
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`first potion 302 of the ribbon wire 300 and the corresponding conductive surface can be formed
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`in circular or curved shapes, such as concentric circular shapes, as shown. Such circularly shaped
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`intermetallics can result, at least in part, from teeth of a wire bonding wedge, as the wedgeis
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`rotated while in contact with the portion 302a of the ribbon wire 300.
`
`[0050]
`
`In comparison with the wedge bond 310, the wedge bond 320 can include
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`intermetallics 322 that correspond with a pattern of teeth on a wire bonding wedge used to form
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`the wedge bonds 310 and 320, where suchteeth interface (engage, etc.) with the ribbon wire 300
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`to hold it in place during the wire bonding operation. As shown in FIG. 3A, the intermetallics
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`322, in this example, are diamond shaped. In other implementations, other shapes can be used,
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`such as circles, squares, triangles, stars, etc.
`
`[0051]
`
`The portion 302c of the ribbon wire 300 can form a wire loop between the portion
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`302a andthe portion 302b. Thatis, the portion 302c of the ribbon wire can extend between
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`(electrically connect) the wedge bond 310 and the wedge bond320,as well aselectrically
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`connecttheir correspondingelectrical contact surfaces.
`
`[0052]
`
`As shownin FIG.3A, the portion 302a of the ribbon wire 300 can havea first
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`width W1 transverseto the longitudinal axis L, while the portion 302c of the ribbon wire 300 can
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`have a second with W2 transverseto the longitudinal axis L. In this example, the first width W1,
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`due to spreading of the ribbon wire material during formation of the wedge bond 310, is greater
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`than the second width W2. As further shown in FIG. 3A, the portion 302b of the ribbon wire 300
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`can have a third width W3 transverse to the longitudinal axis L, where the third width W3is
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`substantially, approximately or about equal to the second width W2 ofthe portion 302c.
`
`[0053]
`
`Referring to FIG. 3B, a ribbon wire 350 is illustrated, where the ribbon wire
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`includes a portion 352a, as portion 352b and a portion 352c. Similar to the ribbon wire 300, the
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`ribbon wire 350 can extend along a longitudinal axis L1. In the example of FIG.3B, the portion
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`352a of the ribbon wire 300is illustrated as being coupled with a corresponding conductive
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`surface with a wedge bond 360, while the portion 352b is illustrated as being coupled with a
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`-12-
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`

`

`Attorney Docket No. 0210-152001
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`corresponding conductive surface with a wedge bond 370. In the example of FIG. 3B, both the
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`wedge bonds 360 and 370 are formed using the approachesdescribed herein for forming wedge
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`bondsusing multi-axis ultrason