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Semiconductor Manufacturing International (Beijing Semiconductor Manufacturing International (Shangha

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SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING) CORPORATION SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION

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Hailong YU Bo SU Hansu OH

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SEMICONDUCTOR STRUCTURE AND FORMING METHOD THEREOF

17/955,955 | U.S. Patent Application

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Location ELECTRONIC

Filed Sept. 29, 2022

Examiner DOCKET CENTRAL

Class 257

Art Group OPAP

Case Type Utility - 257/347000

Status Docketed New Case - Ready for Examination

Child 202111155645.9

Last Updated: 1 year, 6 months ago

Date	#	Transaction
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SEMICONDUCTOR STRUCTURE AND FORMING METHOD THEREOF

17/955,955 | U.S. Patent Application

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