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MOLDING APPARATUS OF SEMICONDUCTOR PACKAGE

18/134,718 | U.S. Patent Application

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Filed April 14, 2023
Examiner Yung-Sheng M Tsui
Class 425
Art Group 1743
Patent No. 12,394,641
Case Type Utility
Status Patented Case
Last Updated: 2 weeks, 1 day ago
Date # Transaction