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"PACKAGING OF SEMICONDUCTOR CIRCUIT IN PRE-MOLDED PLASTIC PACKAGE"

08/938,874 | U.S. Patent Application

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Location FILE REPOSITORY (FRANCONIA)
Filed Sept. 26, 1997
Examiner NGAN NGO, V
Class 257
Art Group 2814
Patent No. 5,869,883
Case Type Utility - 257/667000
Status Patented Case
Last Updated: 1 year, 4 months ago
Date # Transaction