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Inventors

Chih-Ming Ho Chun-Chih Liang

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Everlight Electronics Co., Ltd.

Assignee

EVERLIGHT ELECTRONICS CO., LTD.

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Side View Semiconductor Package Structure and manufacturing method thereof and Electronic Device incorporating the same

62/550,694 | U.S. Patent Application

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Location ELECTRONIC

Filed Aug. 27, 2017

Case Type Provisional

Status Provisional Application Expired

Child 16/113,116 Patented

Last Updated: 4 years, 2 months ago

Date	#	Transaction
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Side View Semiconductor Package Structure and manufacturing method thereof and Electronic Device incorporating the same

62/550,694 | U.S. Patent Application

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