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INTEGRATED CIRCUIT HAVING STRUCTURAL SUPPORT FOR A FLIP-CHIP INTERCONNECT PAD AND METHOD THEREFOR

11/33,009 | U.S. Patent Application

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Location ELECTRONIC
Filed Jan. 11, 2005
Examiner ASOK K SARKAR
Class 438
Art Group 2891
Patent No. 7,247,552
Case Type Utility - 438/618000
Status Application Involved in Court Proceedings
Child PCT/US05/43220 Published
Last Updated: 2 years, 11 months ago
Date # Transaction