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Displaying 69-83 of 110 results

2012 Exhibit: CV of Dr Robert Darveaux

Document IPR2017-00842, No. 2012-18 Exhibit - CV of Dr Robert Darveaux (P.T.A.B. Nov. 20, 2017)

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2010 Exhibit: Transcript of the Deposition of Jianmin Qu, PhD Oct 31, 2017

Document IPR2017-00842, No. 2010-16 Exhibit - Transcript of the Deposition of Jianmin Qu, PhD Oct 31, 2017 (P.T.A.B. Nov. 20, 2017)

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2013 Exhibit: Kyocera Corporation, Material Properties of Ceramics Substrate Nov...

Document IPR2017-00842, No. 2013-19 Exhibit - Kyocera Corporation, Material Properties of Ceramics Substrate Nov 19, 1999 (P.T.A.B. Nov. 20, 2017)

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2012 Exhibit: CV of Dr Robert Darveaux

Document IPR2017-00842, No. 2012 Exhibit - CV of Dr Robert Darveaux (P.T.A.B. Nov. 20, 2017)

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2011 Exhibit: Declaration of Dr Robert Darveaux

Document IPR2017-00842, No. 2011 Exhibit - Declaration of Dr Robert Darveaux (P.T.A.B. Nov. 20, 2017)

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2013 Exhibit: Kyocera Corporation, Material Properties of Ceramics Substrate Nov...

Document IPR2017-00842, No. 2013 Exhibit - Kyocera Corporation, Material Properties of Ceramics Substrate Nov 19, 1999 (P.T.A.B. Nov. 20, 2017)

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2014 Exhibit: HD MicroSystems, Product Bulletin HD 4100 Series Polyimide June 2...

Document IPR2017-00842, No. 2014 Exhibit - HD MicroSystems, Product Bulletin HD 4100 Series Polyimide June 2006 (P.T.A.B. Nov. 20, 2017)

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2010 Exhibit: Transcript of the Deposition of Jianmin Qu, PhD Oct 31, 2017

Document IPR2017-00842, No. 2010 Exhibit - Transcript of the Deposition of Jianmin Qu, PhD Oct 31, 2017 (P.T.A.B. Nov. 20, 2017)

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2005 Exhibit: US Patent No 7,525,189

Document IPR2017-00842, No. 2005-14 Exhibit - US Patent No 7,525,189 (P.T.A.B. May. 30, 2017)

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2006 Exhibit: Flip Chip Technologies excerpt

Document IPR2017-00842, No. 2006-15 Exhibit - Flip Chip Technologies excerpt (P.T.A.B. May. 30, 2017)

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2004 Exhibit: Microelectronic Packaging excerpt

Document IPR2017-00842, No. 2004-13 Exhibit - Microelectronic Packaging excerpt (P.T.A.B. May. 30, 2017)

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2001 Exhibit: Modern Semiconductor Devices for Integrated Circuits 2010 excerpt

Document IPR2017-00842, No. 2001-10 Exhibit - Modern Semiconductor Devices for Integrated Circuits 2010 excerpt (P.T.A.B. May. 30, 2017)

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2003 Exhibit: Thermal Thermal Conductivity, Kyocera

Document IPR2017-00842, No. 2003-12 Exhibit - Thermal Thermal Conductivity, Kyocera (P.T.A.B. May. 30, 2017)

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2002 Exhibit: Thermal Heat Resistance, Kyocera

Document IPR2017-00842, No. 2002-11 Exhibit - Thermal Heat Resistance, Kyocera (P.T.A.B. May. 30, 2017)

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2004 Exhibit: Microelectronic Packaging excerpt

Document IPR2017-00842, No. 2004 Exhibit - Microelectronic Packaging excerpt (P.T.A.B. May. 30, 2017)

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