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QCIA LINKFABRIC

50061766 | Trademark

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Filed Aug. 20, 2026
Serial No. 50061766
Class Semiconductor substrates incorporating integrated interconnect structures; semiconductor substrates supporting localized electrical interconnects; semiconductor substrates supporting die-to-die and chiplet-to-chiplet communication; semiconductor substrates incorporating embedded bridge interconnects; silicon and silicon carbide substrates incorporating high-density signal-routing structures; semiconductor package substrates supporting heterogeneous integration and integrated-circuit connectivity; semiconductor substrates incorporating embedded, bridge-like and monolithic interconnect structures; semiconductor substrates for AI, HPC, communications, aerospace, defense, and advanced semiconductor packaging applications.; 021; 023; 026; 036; 038
QCIA LINKFABRIC
Case Type Trademark
Status New application awaiting assignment to an examining attorney. <a href="https://www.uspto.gov/dashboard/trademarks/application-timeline.html">See current trademark processing wait times </a> for more information.
Last Updated: 5 days, 10 hours ago
Filing Date # Docket Text