Filed Nov. 4, 2026

Serial No. 50199001

Class Custom manufacturing of semiconductor circuits; Custom manufacture of semiconductor components; Custom manufacture of semiconductor devices; Encapsulation of semiconductors for others; Custom manufacture of semiconductor wafers; Custom manufacture of heterogeneously integrated semiconductor modules; Custom manufacture of multi-chip modules; Custom manufacture of system-in-package semiconductor modules; Custom manufacture of semiconductor chiplet modules; Custom manufacture of photonic integrated circuits; Custom manufacture of optoelectronic integrated modules; Custom manufacture of co-packaged optical modules; Custom manufacture of interposer-based semiconductor packages; Custom manufacture of three-dimensionally stacked semiconductor packages; Prototype fabrication of new products for others; Contract manufacturing in the field of semiconductor integrated modules; Manufacturing process consulting; 100; 103; 106

Case Type Service mark