CX-O02
`
`ANALOG
`DEVICES
`Data Sheet
`
`OmnidirectionalMicrophonewith
`BottomPort and AnalogOutput
`ADMP404
`
`FEATURES
`
`GENERAL DESCRIPTION
`
`Tiny 3.35 mm ><2.50 mm x 0.88 mm surface-mount package
`High SNRof 62 d8A
`High sensltlvl ty of -38 dBV
`Flat frequency response from 100 Hzto 15 kHz
`Low current consumption: <250 |.iA
`Single-ended analog output
`High PSRRof 70 dB
`Compatible with Sn/Pb and Pb-free solder processes
`RoHS/WEEEcompliant
`
`APPl.lCATlONS
`
`Smartphones and feature phones
`Teleconferencing systems
`Digital video cameras
`Bluetuuth headsets
`Video phones
`Tablets
`
`low power,
`The ADMP*l0=lis high quality, high pertornunce,
`analog output
`l‘>OllOlT‘|'1)01'iCClomnidirectional MEMS n1icr0phnne_
`The ADM P1104consists ofa i\/1iil\/15micmphrme clement, an
`impedance converter; and an output ampiifier. The ADMP-104
`sensitivity specification makes it an excellent choice for both
`near field and far tleld applications. The ADMP404 has Ahigh
`signal etoenoise ratio [Sf\lR)and flat, wideband fi'cqucr1c\/response,
`resulting in natural sound with high intelligibility.lts low current
`consumption enables long battery life for portable applications.
`A l3uilt~inparticle filtcr provides high reliability. The /\DMl:'404
`complies with tl1c'i‘lA~9ZO Telccmiirritmicuiions liileplzzme
`Trzrminal Equipment
`TV6lYZS7!liSFi()11Requirenie11ts_f0i'
`l/Videlmml
`Digitril Wireliim T(:‘l(i[7l1()1I!£$stanzlard.
`The ADMP404 is available in an ultraminiaturc 3.35 mm X
`
`250 mm ><(1.88 mm Sufi‘-'§Ci‘.<l1'1fi‘.ll1Il'>z\Cl{£1‘§_;t°..It at reflnw solder
`
`compatible with no sensitivity ziegmclatioii.The ADMl’404 is
`halide free.
`
`FUNCTIONAL BLOCK DIAGRAM
`
`l
`
`output
`AMPLlFlER
`
`. OUTPUT
`
`2 7
`
`%
`
`>
`
`Figure 7.
`
`ADMP404
`
`Rev. B
`infcirmdion furnished by Analog Darius is believed in be mime» arr! rdiable. However,no
`resp<x\sibiItylsmsurr\edbyAniiogDavtces5orihusi.iwortovarryiiffingenuntsdpawrrsorodwer
`riglisnfthirdpnrtiesflutwwyrsulfiomisuse.S9edficz1i)I\ssubjeC\wd\angewlthoi!lr\doeNo
`ioenseisgrarvbed byimpiationormherwise uride\'anypaten(o'rpd=ernri3h1sofAnaJogDevices
`Tradanudsandregttemdzmdemarksarethepmpenyufthdrrspecfiveovmevs.
`
`One Technology Way, P.O. Box 9106, Nnrwciod, MA 02062-9106, U.S.A.
`Tel: 781.329.4700
`www.analog.com
`Fax:781.461.3113
`©2(l10~2011 Analog Devices, lnc. Allrights reserved.
`
`KE-825|TC-00006518
`
`KE-6804NDlL-000003314
`
`CX-002.001
`
`

`
`ADMP4U4
`
`Data Sheet
`
`TABLE 0F CONTENTS
`Features
`.........................................................................1
`
`Applications.i....i......,...
`GeneralDirscripiinn
`
`Functional Block Diagram ......................................................
`
`Revision History
`
`Specifications............i.i......i.....i..
`
`1
`1
`
`1
`
`Z
`
`3
`
`Absolute Maximum Ratings ...........................................................,/1
`BSD Caution....i..i.......................
`......
`.............................. ._4
`
`Pin Configuration and Function lkscriptions .....................
`
`3
`
`Connecting to Analog Devices, inc., Audio Codecs ..............AI7
`............................................ ..7
`Supporting Documents ..................
`........................... ..
`
`PCB Land Pattern Layout ...................
`
`Handling instructionsi..,...........,.
`
`............................................ ..9
`Pick and Place Equipment ..............
`Reflow Solder ...................................
`............................................ ..9
`
`Board Wash
`
`...........................
`............................................ ..9
`
`........................... ..
`Reliability Specifications .....................
`Outline Dimensions ............................
`........................................... ll
`
`li)
`
`Typical Performance Characteristics
`
`...........................................VY6
`
`......................................... .. 11
`Ordering Guide ..............................4
`
`Applications information ................................................................ 7
`
`REVISION HISTORY
`
`8./l l——Rcv.A to Rev. B
`Changesto Figure
`Changes to Supply Voltage Parameter, Table 1
`Changes to Talile
`Added Connecting to Analog Devices, Inc., Audio Codecs
`Section and Supporting Documents Section
`Changes to Pick and Place Equipment Section
`[Z0 kg 10 10
`Adclcc LGA_CAV Tape and Reel Outliiic Diincnsioiis,
`Figure I2
`.............................................. .. I l
`
`1
`
`3
`4
`
`7
`
`12/lO~Rev, Oin Rev. A
`Changes to Applications Section and General
`Description
`Changes to Table
`Changes to Table
`
`7/l0——Revision 0: Initial Version
`
`9
`
`RPv. B i Page 7 of I2
`
`KE-825|TC~0O006519
`
`KE—6804NDlL-000003315
`
`CX-O O2.O02
`
`

`
`Data Sheet
`
`SPEBIFIBATIDNS
`
`Al]MP4U4
`
`TA = 25“C, Vnn ><1.8 V, unless utherwiate nnhrii. All minimum and maximum s ccificatiuns are t1a1'anteed.'l"
`P
`2%
`W
`guaranteed.
`
`ical s ccifications are not
`P
`
`] Symbol I TestConditions/Comments
`
`I Min Typ
`
`Max i Unit
`
`dBV
`
`di3A
`d8A SPL
`dB
`Hz
`kHz
`dB
`
`% d
`
`B
`d8 SPL
`
`V u
`
`A
`
`Q V p
`
`A
`
`-4‘.
`
`1.5
`
`Omni
`'38
`62
`32
`88
`‘I00
`15
`'3/+2
`
`70
`120
`
`200
`0.8
`90
`
`3
`
`33
`250
`
`i kHz, 94 dB SPL
`
`Derived from EINand maximum acoustic input
`Lowfrequency ‘S dB point
`High trequency ~3 dB point
`Deviation limits from flat response within pass band
`105 dB SPL
`
`217 Hz, 100 mV p~p square wave superimposed on Van= i .8 V
`Peak
`
`SNR
`
`EIN
`
`THD
`PSRR
`
`\./no
`
`is
`
`ZOUY
`
`Table l.
`
`Parameter
`PERFORMANCE
`Diroctionaiity
`Sensitivity
`Signai~to»Nnise Ratio
`Equivalent Input Noise
`Dynamic Range
`Frequency Response‘
`
`Total Harmonic Distortion
`Power Suppiy Rejection Ratio
`Maximum Acoustic input
`POWER SUPPLY
`Suppiy Voltage
`Supply Current
`OUTPUT CHARACTERISTKS
`Output impedance
`Output DCOffset
`Output Current Limit
`
`‘See Figure 4 and Figure 6.
`
`Rev. B i Page 3 of 32
`
`KE-825iTC-00006520
`
`KE-6804NDiL-000003316
`
`CX-002.003
`
`

`
`Al]MP-404
`
`Data Sheet
`
`ABSOLUTE MAXIMUM RATINGS
`Table 2.
`Parameter
`Supply Voltage
`Sound PIBRSUYFLevel (SPL)
`Mechanical Shock
`Vibration
`
`Rating
`~03 V to +3.6 V
`160 dB
`10,000 g
`Per Nlll..~STD-883Method 2007,
`Test Condition B
`~4(}°Cto I-70°C
`
`Temperature Range
`
`Stresses above those listed under Absolute Ma:-zimumRatings
`may cause permzment damage to the device. This is a stress
`rating only; functional operation ofthe device at these or any
`other conditions above those indicated in the operational
`section uftliis speeilicatioii is not implied. Exposure to abwlute
`maximum rating conditions for extended periods may affect
`device reliability.
`
`ESD CAUTION
`ESD [electrostatic discharge] sensitive devize.
`Charged
`devices
`and
`circun
`boards
`can LlISCl"|3YQE
`without detection. Although this product
`features
`patented or pruprmtary protection nircuilry, damage
`
`may occur on devices subjected to high energy ESD,
`Therefore, proper ESD precautions should be taken to
`avoid performance degradation ar lass of functionality.
`
`Y, ________________________ ._
`RAMPMP
`
`Tsuax
`
`Tsmm
`
`CRITICALZUNE
`
`!r_ _
`
`K
`
`TL TO 1;.
`
`‘$11.,
`Igi ~
`$1 -=3S‘;
`
`\L? _
`
`. . . _ . _ . . . -‘.s__ _ _ _ __ /
`/1
`pRE[.§EAT
`//
`
`RAMP-DOWN
`
`/
`4-------
`
`,1
`'
`rawTOPEAK_--_>l
`
`[
`
`‘
`
`\
`
`\
`
`TIME
`Figure 2. Recommended Soldering Profile Limits
`
`3
`
`Table 3. Recommended Soldering Profile Limitfi
`Profile Feature
`Average Ramp Rate (TI to TV]
`Preheat
`Minimum Temperature (Tammi
`Maximum Temperature (TswI;<)
`Time
`(Twin ZOT-wt/I14),is
`Ramp up Rate (TIM to TL)
`Tune Maintained Above Liquidous (ti)
`Liquidous Temperature (TL)
`Peak Temperature (T?)
`Time Within 5°C of Actual Peak Temperature (ti-)
`RampvDown Rate
`Time 25°C(tut) to PeakTernperature
`
`SnlPb
`125°C/sec maximum
`
`Pb-Free
`125°C/sec maximum
`
`100“C
`150°C
`60 sec to 75 sec
`125°C/<.ec
`45 sec io 75 sec
`183°C
`215°C + 3°C/~3°C
`20 sec to 30 sec
`3°C/sec maximum
`5 minute maximum
`
`1SO"C
`200°C
`GDsec to 75 sec
`125°C/sec
`~50 sec
`217"C
`245°C + 0°C/—5°C
`20 sec to 30 sec
`3°C/sec maximum
`5 minute maximum
`
`Rev.B[Pa_r;e4of12
`
`KE-825lTC—O0O06521
`
`KE-6804N DIL-OOOOGS317
`
`CX-O O2.O04
`
`

`
`I Data Sheet
`
`Al]MP4IJ4 I
`
`PIN CONFIGURATION ANI] FUNCTION DESCRIPTIONS
`
`GND
`2
`
`I
`
`I
`
`\
`
`4
`1'
`
`1
`
`ADMP404
`
`------- -.
`1
`OUTPUT
`
`- - - - - ——4
`
`3
`
`‘
`v
`I
`:____°f___
`
`TOP VIEW
`(TERMINAL SIDE DOWN]
`Not lo Scale
`
`'*
`1
`
`rlgwe 3. Pin Cunflgumnur
`
`I Descrlptlon
`Analog Output Signai
`Ground
`Power Supply
`
`Table 4. Pin Function Descriptions
`Pin No.
`I Mnemonic
`OUTPUT
`GND
`\/an
`
`I 2 3
`
`R6! B Page5ofI2
`
`KE-825ITC—OO0O6522
`
`KE-6804NDIL—OOOOO331 8
`
`CX-002.005
`
`

`
`ADMP404
`
`Data SIIGBI I
`
`TYPICAL PERFORMANCE CHARACTERISTICS
`
`fl
`
`IIII
`
`E‘E
`
`-10
`
`I IIIIIII
`I
`IIII
`I 1 IIIII
`
`FE2
`
`>E
`
`FREQUENCY (H2)
`
`Figure 4. Frequency Response Mask
`
`FREQUENCY my
`figure 6. Typicalfreq uency Response (Measured)
`
`jg
`
`W20T36-H-40
`
`E2
`
`tn
`
`E
`
`60
`
`$6-III"
`
`I 00
`
`I K
`
`FRE(1UENCV(H2j»
`
`Ifik
`
`-i
`
`Ffgwe 5, Typical Powez Supply Rejection Ratio vs. Frequency
`
`Rev.B|Page6of12
`
`KE-825ITC-00006523
`
`KE-6804N DIL-000003319
`
`CX-O O2.O06
`
`

`
`Data Sheet
`
`ADMP404
`
`APPLICATIONS INFORMATION
`CONNECTING TO ANALOG DEVICES, INC., AUDIO
`CODECS
`
`The ADMP4-O4output can he connected to 2 dedicated coder
`microphone input (see Figure 7) or to a high input impedance
`gain stage (sec Figure 8). A O.l IJFceramic capacitor pIacrd dose
`to the ADMP404 suppiy pin is used for testing and is recom­
`mended to aduquaicly decouple the microphone from noise on
`the puwcr suppIy. A dc~hIoc.I<ingcapacitor is required at the
`output of the micmphmic.
`
`Q MICBIAS
`
`O.IpF
`
`.
`Van
`
`Q;
`
`ADMPM34
`output 0
`
`GND
`
`0
`
`22”‘:
`MINIMUM
`
`ADAU17S1
`OR
`ADAU13$1
`0 LINN
`-. GM
`
`0 LINP
`
`L;
`
`Figure 7. ADMP/I04 Connected to the Anafog Devices ADAUI/'61 or
`ADAI/I361 C0096
`
`0 wF
`
`.
`V00
`ADMP404
`OUTPUT O
`em:
`'
`="
`
`GAIN=(R1+ R2)IR1
`
`R1
`
`R2
`
`$
`
`V
`
`REF0
`
`“PF
`MINIMUM
`
`10m
`
`Var
`
`0 Vom­
`
`‘
`2‘
`E
`
`Figure 8. ADMP404Connected to the OPU7 Op Amp
`SUPPORTING DOCUMENTS
`Evaluation Board UserGuide
`
`UG-142, EVAL-ADMP404Z~FLL'X:Bottom-Porteri Armlog
`Output MEMS Micmphnfle IjvrzluutionBoard
`Application Notes
`
`AN' IO03, Rz:wi'nmerzdutimlsfizrMounting um! (fonnccting
`Aiming Dcvzles,Imi, Bottom-Ported MEMS Microphones
`
`AN P1068, Rqflow Soldering ofthc A/IEM-SMicrnphorm
`
`AN~l I I2, Mr'(rnphm1eSpecifications Explained
`
`AN-I I24, Remmmemlati01zs‘fm'SealingAnalng Devices, Inc,
`Bottom-Port MFMS 1\Jirr0pl1nnes_frnmDust and Liquid
`ingress
`
`Rei/.B1Page 7 of I2
`
`KE-825ITC—OOOO6524
`
`KE-6804NDIL—O0000332O
`
`CX-002.007
`
`

`
`ADMP4U4
`
`Data Sheet
`
`PCB LAND PMTERN LAYOUT
`The recominended PCB lmid pattcrn fur the ADMP404 should
`be laid nut lu a lzl raiiu to the sulclcr pads on the microphone
`paulmgc,as sliuwu in Figure 9. Care should be takm tn avoid
`applying snldcr paste m the smmd hole in the PCB. A suggested
`
`solder paste stencil pattern layout is shown in Figure 10.The
`diameter ofthc sound hole in the PCB .should be larger than the
`climneter ofihe sound port ofthe microphone. A minimum
`diameter 0f0.5 mm is rvcommended.
`
`1s2--——~—>
`
`I
`
`,
`
`2!\l
`
`Figure 9_Pf B1and Parrern I ayou!
`
`O H K 5 G
`
`1 5513.05 DlA.
`0,225 cur WlDTH(21<)
`
`R Z
`
`‘Yj
`
`~
`
`~. _l
`
`~
`
`1 £61.55
`
`’
`
`210.95
`
`122
`
`+
`
`“
`
`0.2-45
`
`‘
`
`E
`152mm
`1
`WP
`Figure I0. Suggested $nIds=rPaste Sremfil Patteln I nynu!
`
`Rev. Bl Page 8 of12
`
`KE-825lTC-00006525
`
`KE—6804NDll.-000003321
`
`CX-002.008
`
`

`
`Data Sheet
`
`ADMP404
`
`HANDLING INSTRUCTI UNS
`PICK AND PLACE EQUIPMENT
`
`The MEMS microphone can be handled using standard pick,
`u11cl—pla¢eand drip slrocting cquipmem. Cart‘ §‘nnnl(lhe taken
`in zwulil damage to llxc MEMS micrnphnnc
`STr\1C‘[l]\‘€as Follows:
`
`0
`
`I
`
`I
`
`I
`
`Use Astandard pickup tool to handle the niicroplumc.
`Because the microphone lmlc is on tl\cl:<1tl(>rri<1fllic
`package, the pickup tool can make contact with any part
`of the lid surface.
`
`Use care (luring pick~ancl—pl;1ceto ensure that no high
`shock events above l0 kg are experienced because such
`events may cause d-amageto the micropnoner.
`Do not pick up the microphone with a vacuum tool that
`makes contact with the bottom side of the microplionc.
`Dc»not pull air out of or blow air into the micmphone port.
`Du nut use cxccssivc force tn place Themitmphone on
`lllc PCB.
`
`REFLOW SOLDER
`
`For best results, the soldering profile should be in accordance
`with the rrrcunnnenrlations of the manufacturer of the solder
`paste 11:»:-(lto attach the MEMS microphone
`to the PCB. It is
`recommended that the solder reflow profile not exceed Thelimit
`conditions specified in Figure 2 and Table 3.
`BQARD WASH
`
`‘Nhcn washing the PCB, unsure that water does not make
`contact with the microphone port. Blnvv-offprocedures and
`ultrasonic cleaning must not he used.
`
`Rev. 8 IPage 9 of 12
`
`KE-825lTC—0O006526
`
`KE-6804NDlL—OOOO03322
`
`CX-002.009
`
`

`
`ADMP4U4
`
`RELIABILITY SPECIFICATIONS
`
`TI1L’mI4;1UpI"l\)11t.‘srsusilivity after stress mum rivviarrr by no more than £3 dB from the initial vahze.
`
`Data Sheet
`
`Table 5.
`Stress Test
`Lo\;§rI;E;rrperatureOperating Life
`I-SighTemperature Operating Life
`Temperature Humidity Bias (THB)
`Temperature Cycle
`HighTemperature Storage
`LowTemperature Storage
`Component Charge Device Model (CDM)ESD
`Component Human Body Mode! (HBII/I}ESD
`Component Machine Model (MM)ESD
`
`T Description
`~40 C,500 hours, powered
`+125°C, S00 hours, powered
`+65°C/85% relative humidity (RH),500 hours, powered
`410°C/+125°C, one cycle per hour, 100 cycles
`+150°C, 500 hours
`-40°C, 500 hours
`All pins, 0.5 kV
`AI! pins, 1.5 kV
`All pins, 0.2 kV
`
`Re-v.B}PageI0of12
`
`KE-825ITC-00006527
`
`KE—6804NDIL-000003323
`
`CX-002.010
`
`

`
`Data Sheet
`
`OUTLINE DIMENSIONS
`
`_i,,i
`,,.,W______
`3.275
`I_____,hn6REF____i_1_=§
`
`,
`;,/
`
`I
`
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`
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`l
`
`I
`
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`
`I
`=25
`
`U 54 REF
`Q20 TYP
`>145°
`
`BOTTOM VIEW
`
`I
`
`I
`
`I
`
`I
`
`I
`
`221
`REF
`
`TOP VIEVV
`
`A‘
`
`0.55 REF
`
`v'“T
`
`‘—0.21 REF
`
`snoevavv
`
`II
`
`L_
`
`92
`use
`
`5../5
`
`Figure I
`
`7, 3-Tcrmmzfl Chip Array Srr1uIlOu!:'me Nu Lead Cuv1!y[LGA_CAV}
`3.35 mm >12.50 mm Body
`(FF~?~2)
`Dimensions xhovvn IIImillimeters
`
`4.0
`
`01.5 *O.1/OTC
`
`12.0 -H13/'0 I
`
`2O$‘OO5(SEENOTE3)-->
`4,0 (SEE NOTE1\~—>
`‘
`
`<­
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`I
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`3. 85
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`
`I
`55 £7115
`
`____H
`
`1.13
`POCKET HOL5
`OFFSET
`
`2.50
`
`RQ3 Typ
`
`0.75 MIN
`
`NOTES
`1 10 SPROCKET HOLE PITCH CUMULATIVETOLERANCE £12.
`2. CAMBER IN COMPLIANCE WITH EIA 481,
`3. POCKET POSITION RELATIVE TO SPROCKET POLE MEASURED
`AS TRUE POSITION OF POCKET‘ NOT POCKET HOLE.
`4, Ac, AND B0 ARE CALCULATED ON A PLANE AT A DISTANCE "R"
`move THEaorom or THEPOCKET.
`
`Figure 72.I,GA_CA\/Tap? and Red Outline Dimensions
`Dimensions shown In miflimerers
`
`DRDERING GUIDE
`
`Model‘
`ADMP4()4ACE2~RL
`ADMP404ACEZ-RL7
`EVAI.»/\DMP404Z~I'I.EX
`
`I Temperature Range
`-40 C to +7O°C
`—~’I0“Cto I-70°C
`
`I Package Desciigligf
`34TerminaI I.GA_CA\1,I3"Tape and Reel
`3~TerminaI LGA_CA\l, 7"Tape and Ree!
`Evaiuation Board
`
`I PackageOption‘
`CE'3—2
`CE-3—2
`
`I Ordering Quantity
`10,000
`1,000
`
`‘ Z= RQHS CompI6a11!ParI.
`1This oackage option is halide free.
`
`Rev.BIPageHof1Z
`
`KE—825|TC-00006528
`
`KE-6804NDIL-000003324
`
`CX-002.01 1
`
`ADMP4I]4
`
`>4~IOS-+~
`
`O3D_
`55°
`
`I
`
`_ _k
`VT I
`
`,__
`/H Q32 “OM am
`I’ 2“ MI"
`rmiu HOLE
`1'55 DIA \3OUND F‘OR7I
`
`I
`
`-085 DIA.
`
`I
`1
`
`on REF
`;..___*
`/_,REFERENCE 030359-;
`*
`*
`CORNER
`0.90 >1uea
`(P|Ns1,a1“‘
`F
`054 “I
`‘
`REF '~
`
`2.515
`Qffifi
`2.425
`
`

`
`|ADMP4U4
`
`NOTES
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`DataSheetl
`
`@2010-Z011 Analog Devices, Inc. All rights reserved. Trademarks and
`regusteved trademarks are the property M their respective owners‘
`0os51a‘0~B/IHB)
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`W W
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`I
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`I
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`W 3 fl H
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`U Q . B U m
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`‘
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`Rev. B Page 12 of 12
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`KE-825lTC-00006529
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`KE-6804NDIL-000003325
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`CX-002.012