`2;1
`Release
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`Contents ~CL~VfLAND PUBLiCUB
`
`LIST
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`Of TABLES ..CJ£dCE&TECHNOLOGy~i:~*
`JUL28 199/Ji
`L.ISlof Tables 'm................. ............................. ....................:.............;................ ..............:r.... ......... ............1)(
`.m'W.£
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`1.iGENERAL
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`1.1'lntroduetion ...........,;...........................,....................................................................,.........................1.3
`1.2 Relationship to Other Stândal,d..SetlngSoqles..........................;..................;.........,.................1.3
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`1.aHlstory......... ...... ........ ............................................................................................,......... ...............,;;..1-'
`t.4iStandardlzatlon Goals ........ ............................................................................................ ..................A.a
`and 2.0 ............................,..........................,..............................., 1-4
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`Releasè
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`1.0
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`1.5 Differences Betweèn
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`2..SSÐPE
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`2.1 ElementsoftheSlandard:Physlcal,lnterfce, Software...............................................................2.3
`2.2;Card'Physlcal ........................................................................................................;.........................:..2"3
`2.3 Card' Inteiface .....................;....;..;......;.;...............;..;..........................................;.................................2.3
`2.4 Card Software ......................................................;............................:.;.............,..................;..............2-3
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`3.~ CARDPI-VSlCAL
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`Card Dimensions................................................;.....................................;.........................................3.3
`3.1.1 Write Protec Switch (WPS).......................................................................................................................... 3.3
`3:1.2Batler locon ......... .... .......;.,;...... ~..... ,.....,. .,......... ...., ........ ........ .... .,....... .......... ..'.. 'c.. ....... .,......... ........... ".~3,3
`3.1.3 Label.............. ................;..............,.............;......;.................,.....,.......................:......................................,,..,3.4
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`Cónneetor ...............................................................,..........................................................;,;................3-4
`3:.2.1 . Card Conneor .............................................................................................................................................3-4
`3.2,2 Host Connector..... ......................................... ....... ...... ............. .................................... .......... ........................ 3-4
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`3.3 PC Card Guidance .........;................................. .................................................. ....... ..........................3.5
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`3.4 Connector Reliabilty ....................................................................................;;...................................3-
`3.4.1 Mechanica Performance .....~..............,....................;......;.........................................................................;,...3-6
`3.4.1.1 Offce EnvirOhmenL;.........................;.....;......................,.........,..........................................................3.6
`........................ ..................................3-6
`3.4.1.2 Harsh Environmenl...................................................................
`3.4.1.3 Toiailnserjon Force..............................................................;....,~.................;.....,............;................. 3.6
`3.'.104 Tolal Pullng Force......................................................................................................;.......................3-6
`3.4.1 .5 Single Pin PullhgForce ....... .................. ..... ...... ...................................... .. ....... ...... ...... ............. ......... 3c6
`3.4.1.6 Single Pin HoldingForw,...................................................................................................................3-
`3.4.1.7 Single SoetHoIdingFoft:....." ....... ....... ..... ........ .... ...... ......... .... ............... ........;. ...... :..................... 3-7
`.......................,.,.................3.7
`Frequency.....;...........................................................
`3.4. 1.BVibration and High
`3.4.1.9 Srioc..............................................................................................................................c................... 3-7
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`July,t99:'.
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`SANDISK Exhibit 1009, Page 1 of 550
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`,......:~tifdbIA ReGAD STANDARÒ
`ReIease2.1 ........ '.' .... .... ." '.i.ii. ..hi; .......... .... ..... ............ .'. ..... . . . ./. ".
`342r-~~!~~~:~:::::":::~-~;:::~d:¡:::dd:d:~::::d;;:::d;~:~~~
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`3.4.~.3Insulatìon Resistan........................................... .......................,.,....................... ..............................3.8
`3.4,ZACurrent Gapacì..........................................................................................................:........c..............3-8
`3.4.2.51nsulajion Material ..................................................................................................c............................ 3-8
`3.4.3 Envirçnmen1a ?erormanee..........................................,...c............................................................................. 3-8
`3.4.3.1 Operating ËnvironfYt......................................................;......;.;.~..............................................."c.. 3-S
`Envonment ............. ......................... ........ ....... ................... .......... ....... ". ........;... .....';...........3-8.
`3. 4.3.2
`$torage
`3.4.4 Environmental Re$$taiCf ....................;........................................................ ...........;;...........;....."................ 3c8
`3.4.4.1 Moiture Resistance ..................................................................................................".... ..................3-8
`3.4.4.2 Theral Shoc.....................................;........;..............;.........................................~......;....................... S.s
`3.4.43 Durabilit (High Tempeatue) ..... .......;..........;..........................................:.,.......................................3-8
`3.4.4.4 Cold Resistánce.......;..,........................;.;....;......................................;.......:.................................."....3.9
`3.4.4.5 Humidity (Noral Conctition)..........................................................................................................;..c. 3.9
`3.4.4.6 Hydrogen Sulfide ...........................................................".,.....;..............................................~............. 3.9
`3.4,4.7 Sall Water Spray............."............................................;...;......................................;;..~,....................., 3-9
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`3.5:Connecor DurablUty ...............;..;................. .......................;;.........................,..................................3~9
`3.5.1 Ofice Environment .................................................;....................................................................................,..3-9
`3.5,2 Ha.'S Envifonment.................;....................................................................................................................3.10
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`3.5 PC Card Eniiironmentai.............................;...............................................;,.....................................3-10
`3.6.1 Enllormental Perlprmar..........,..................................;........".....;...........................................................3-10
`3.6.1.1 Operating Envirçnment...................................,................................................................................ 3.10
`3.6.1..2 Stórage EnvlronmenL......... ....................;................ ........... ...... ....................................................... 3.1 0
`.t62Ellvironmenlal ResiSlance...;......................................................;....,.,;...........................................;............3.11
`3;6.2.1 High Storage Temperatwe......................,.....................................,...................;...;...;.....,................3.11
`3.6.2.2lów SlorageTemperalùre ........................................... ....... ...............,;.c.~.................. .................... "..3- t 1
`3.K;2.3 High Oprating Temperature.;............................................;....;,.......,.......,.........;...................;......;....3-11
`low Operaling Temperalure............................................,............................................................,...3.11
`3.6.2.4
`3.6.2.5 Thermal Shock.....,...................................................,..;......,;....L....;.,...................................L.:.;....... 3-11
`3.6.2.6 Moisture Resstce...........,.....................,........................;...........................,..........;.....;................. 3.12-
`3.6;2.7 Elecrostatic DiSchatge .....................c.;..................................... .......................,.................................3.12
`3.6.2.8 X-ray Exposure ................. ................... ................ ............................,.......... ..................................... .3-12
`3.6.2.9 Ultraviolet Ught ExpO$ure:..;.;..............................................,..;.....~....;.,................................;...;.;,;..,3.12
`Field.lntetference...'..... ... ..... ............ ...;......;. ......... ............ ........... .... ..., ..;... .....;. .;..3.12
`3.6.2. to Electromagnetic
`3.6.2.11 Card Inverse iriirton;........c....................................................................................,......................3.12
`Frequency ................;................................................................;......................3.13
`3.6.2.12 Vibralìonand High
`3Æ.2.13 Shock...........................................................,...................................................................................3c:13
`3.6.2.14 Bend Test .............................................................................................................;..;...................,.~3-13
`3.6.2.15 Drop Test........................_..............................................................................................................3.13
`3.6.2.16 Torque Test ...........................................................................................,....,.......................;......,...... 3-13
`3.6.2.17 PC Card Warpage .....................................,.........................................................,................;......... 3-13
`3.6:2.18 SAAM Data Retention .............."..........................................................".......................................3-14
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`4..
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`CARD
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`INTERFACE
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`4.'1 'PIn Assfgnments................................................................................................................................4.2
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`4.2 Me-mory Ci:rd Features .....,...........,..~.........................i.......................................:............;.,...............4.-4
`42.1 Memory Types and Speed Version ......................................................... .......................,............__..............., 4-4
`4.2.2 M13mpr Address Space .........................;............"................,.......................................,...............................4-4
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`. 4.2;3/veirClry drily interface ...............................................,,,...,............,,,,........,..............................,..._.......,,,...:.:.4~5
`4,2.4 1/0 Address Space. ................ ........................ .......... ....,.... ............... .......,............... ..... ........................ ...... ...... 4.5
`4.2~5IJO Interace............ .............................................................. ...:............,..,..................;................................ 4-5'
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`July.~f993
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`..... PCMtiA@1g92','19$3'
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`SANDISK Exhibit 1009, Page 2 of 550
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`4.2.6 Custom lnteriaces................................,.................................,........,.............. .......".............. .............4-6
`4.2.7 Corfigurable Cards.....,..,.................................,.,........................;.........................................'......................,.. 4-6
`4.2,8 COlpatibilty Between Revision Levels 01 this Slandard,...........................,.......,............."........................... 4-6
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`PCMCIAPC CARD STANDARD
`2.1
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`Release
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`4.3SlgnaIOesc;rlptlon ...... ............................. ........................................................ .....;.. ......;........ ...........4-7
`4.3.1 Address BUS (AD-A25j,..............,.................,.....,......,..,.........,.........,......'.........................."...,....,...........,..., 4c7
`4.3.2 Data BUS (00:015).........,...................................,...........................:....................................................,..,.....4-8
`'L3.3 Card Enable (cCE1 & .CE2),..."..,......_,..,...................,...,...,.:...,;..............,....................."........;",.."...;".....,..4-8
`4-:3.4 Output Enable (-OE) .,...........,...,..........,.................................,.......,.;..................................,..,.............;....;.....4'8
`4.3.5 Wrile Enable!Program(-WEI-PGM).,.......................,.,....,....................."....... ..........................,..................,.:4-8
`(+RDY/-BSY) ..,...,............:.......;..;.........................................................."..................................4-8
`4.3.6 Ready/Busy
`4.37 Card Delee (.001 & -C02) ..........................................................;......".".;,.;.~...,.............."..............,......... 4-.10
`4.3.8 Write Protect (+WP).,..............................;.............................,....;;..;..."....:.....................................,.......;.....4-10
`"...............,......".....................................................................................,.4-10
`4.3.9 Attribute Memoiy Select (-REG) .
`4.3.10 Battery VoitageOeiec (BVD1 & 8VD2) ;,;............................................................"...ó...............................4.10
`4.3.11 Program and Periptieral VOltage(Vppl&Vpp2) .....................;..........,....;...;....,..........................,........... 4-11
`& GNDl..............................,.............,............................................~....,...;.4~11
`4.3.12 Card VOltage and Ground (Vee
`4.3.13 Ref,ésh (RFSH).................................................;.......................................................................................4-11
`4.3.14 Reserved Pins (RFU)....................,....:.............,..........................................,...................................,...........4.-11
`4.4 Release 2 Signals Affectingß()lh(\èmoryOnly and I¡Olnterfaces....;;;..,..,.;.............................4.11
`En .......,............;.............................,..............,......,;..,...........;........"..............................,.4'11
`.......;....,....;........................................................;..4.12
`(-WAIT).......,.......,...........................;...
`4.51fOlnterface Signals Replacing RFUs;lns...............................................................,.........,......~.....4.1?
`4.5.1 líO Read HORDJ;........,..~,...."..............".,..................................................................;.........,.:....~.....;....;.....4;12
`4.5.2110 W,íie HOWR) ................................,................................................................................,..........,............4-12
`4.5.3 lnput Acknowledge i-INPACK) WO Operation) ......"......................................,......................,...................... 4-12
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`4.4.2 Extend Bus Cycle
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`4.4.1 Card Reset (RES
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`4.6 ItO Interface Signals Replacing MetnorylntêrfaceSignal$.....~...;.¡u............................................4-13
`4;6.1 lIO IS 16 BitPort(-IQlS1ôlJreplacesWPJ.,..........................................................................,...........;....;....;4c13
`-4_6.2 in~erfUpt Request (-IREQ) (replaces +RDYJ-BSYJ ........................................,..,.......................;......:...:.......4-13
`4.6.2.1 Interrupt Request Routing .........................'.....................................................,............................;...4-13
`46.2.2 Pulsed' . andLeVel~¥()EttnlerruptSuppo.. ......... ......... ............................... ............................ ."":.. 4.13
`4.6.2.3 Pu!sedcModelnterrupt SignaL...... .... ............................................................. ."..... ..... ........... .0... ,.......4-14
`4.6.2.4 Level.Modelnterrupt Signaf......................................"......................,...............................;...".....,:..4-14
`4.6.2.5 Interrupts and +RDY/-BSY ..................,............,.....;............,..............,............;..;..,....;..,;;..,..........".4.14
`463 AudioDigital Waveform (-SPKeHrepl~cTs~VD21.,...".. ......c.........................,.................,....,............ 4.14
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`4_8.2 C-ommon Memory
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`4.6.4 Status Changed
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`(-STSCHG) freplacèsBVDtl....... ........ ...~..... .,.........., ...., ................. ........ ........... .............. 4.14
`4.70peraUng Condilions.......................................................................................................................4-15
`4.7.1 Oeault Conditions and Card Identication ................................................................................................. 4-15
`4.8 Memory Function ...................................................................".....................................;....;........,..;..4-15
`4.a.1Common Memory Function ...........................................................,......................................,...................;..4-15
`Head Futictìon.......,..............................................................,.......,.................................4-15
`and Single.Supply Fiash Cards. ..........................4.16
`4.8.3 Common Memory Write Functiör for SRAM. EEPROM
`4.B.4 Common Memory Write Functioo lor OTPROM. EPROM and Flash-Memory ......................................,..... 4.16
`4.8.5 Attribute Memory Functiol1........................,............,.....................................................................................4-16
`4.8.6 Attribute Memory Read Function ............................................................................................................,....4-17
`4.8.7 Attribute Memory Write Function lor SRAM, EEPAOMandSingJe.Suppfy Flash Cards.. ...................... ...,4-17
`4.8.8 Atribute Memory Write Fuoction for DualSuppìy OTPROM, EPROM and Flash Cards ......................;..... 4-17
`4.8.S Write Protect Function ...................,............................................................................................................. 4.18
`4.9 Tlmlng Functions ................................................................,...................;........................................4-19
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`PCMCIA@1992, 1993
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`July,
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`19$3
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`SANDISK Exhibit 1009, Page 3 of 550
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`©CARDaN.
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`: 9.1 CommonMemoryy Timing Spwcification...deceased
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`Ld,92.Somnion Memory ReadTiming for all types ofMemory..
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`"4.9.4 CommonNtemory WileTimingterOTPROM,EPRO arid Flan Memery
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`4.95 AitributsMamory Read Timing Specification...
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`4.9.6 Attribute Memory WriteTining Specification...
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`4? MemoryTiming CHRgTeENrene
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`4.102.1 Card ConfigurationRegisters Address
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`4.10.3 /O Addrass‘Space:‘Decoding...
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`4.10.3.4Independent1/0Address¥ findow..2.
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`4.10.3.2Overlapping VO AddressWindow ..
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`oa13.2 Data Retention...
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`4133 SYPBMOMni
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`4.14.4 YO Transfer Function...
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`4.14.2 1/0 Input Function forWo.Cat BEhaceschascsaepguentinsiglehcnegaheeceacescecesaeseneenee.
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`4.14.3 VO OutputFunction foryO Cards...
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`414.4. KO Read.(input) Timing. Specification
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`calio
`° 4145 VOWrite(Output) Timin ‘Bad
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`4.15 Card Configuration...
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`we AAS“Gonfigu ation. Option Register cesceegectte
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`_ |. -4:15,2 CardConfiguration and Status Register
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`4.15.9 Pin Replacement Register,Organization...
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`vtecreenee
`- 4.15.4 Sockel and CopyRegister
`~__- 4.16 Future Tasks.And:FGMSEKS-osirensensers
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`- 4,16.1 Wnsertion/Removal with Power ative.
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`5.11 Goalsof This Standard...
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`65.4.2 Overview...
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`5.1.3Vendor-Specific Information.
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`, é.21Byte¢OrderWiihin\ Tupies..
`5.2.2Byte Order onWide Cards...citneesee
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`' §.2.3 Tupte Format in Attribuie Memory Space
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`SANDISK Exhibit 1009, Page 4 of 550
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`SANDISK Exhibit 1009, Page 4 of 550
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`PONCIAPC CARD STANDARD |
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`. ‘8244 UseafGommon.MemorySpaceforAtiributeMemoryStorage.
`88.6 Controt Filles ..
`cedcevend esters rteeeteaees
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`5:2.§ LCHSTPL_NULL: The Nuit Gontrol Tuple......
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`5. 6.2CISTPL,_LONGLINK_A, GISTPL_LONGLINK:C: The Long-Link Contral Tuples
`78.3 CISTPL:LINKTARGET:The Link-TargetControlTuple .:...-»
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`5.2.6.4 CISTPL_|NO|LINK:TheNo-Link Controt Tuple......
`- §25.5 CISTPL_END: The End-Ol.List Tuple...
`ws
`62.5.6 CISTPL_|CHECKSUN:“The Checksum Control Tupie...
`$.2:5.7CISTPL_ALTSTA: TheAkernate-Language Sing Tuple..
`. >.266 TupieProcesoRecommendations.
`“E2744 The Device TataField...tener
`| $.2.70.2 Device IDease
`RETDeviceSpreeFie.
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`§.2.8,4 CISTPL_CONFIG:3: Configuration eoBBataRecordingFormats(LayerDParestneernees
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`628:Configuration TPIScssscnesseesnce
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` __
`POMGIA©1982, 1990
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`SANDISK Exhibit 1009, Page 5 of 550
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`SANDISK Exhibit 1009, Page 5 of 550
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`6.5.4 lOCTL Reati (Get CurrenlXIP API Eniry Point)
`655 ¡OeTi Write (Set New XL? API Entry Point) .
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`SANDISK Exhibit 1009, Page 6 of 550
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`PCMCIA PCCARDSTANDARD.
`Release:2.t
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`areeee eeepp eeeee eles
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`AGLosSARY
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`ALT MetaformatGlossary...
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`ate
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`PONCRS1892,ee
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`SANDISK Exhibit 1009, Page 7 of 550
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`SANDISK Exhibit 1009, Page 7 of 550
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`_ “.., POMGIAPC'CARD STANDARD
`J oRelease-2.
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`vo PCMGIA19921983.
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`SANDISK Exhibit 1009, Page 8 of 550
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`SANDISK Exhibit 1009, Page 8 of 550
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`
`List (lfrTaibles
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`List of Tables
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`SCOPE
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`Table 3-1 :PC. Card Dimensions.. ... .............'?...... ...... 'd' ...........d............... ......d....,......,............. .....,,,..................3-3
`Cönnector Pin COnfiLlration.............,...,.....,.......................,...,...,........."...-...,........................,..,..3.4
`Table 3.2: Host
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`CAflDI.NTERFACI;........................... ... ........i........................ ............ ....i.......... .......i./............................. .'i
`Table 4-1: PCMCIA BS99l4i?ín1. T0f4n34~ìgninents.....7.'.................~.'.....2.'.'............,...........................-+2
`Pin 35 To PÍI1ô8Assignments......................:.....................................d.........~...A.3
`PC
`cad
`Table4.2: PCMClA
`Tabie. 4-3: Features of PCMCIA Memry Card ..... ..............'d.....:..........................,............. ..............................4.4
`Types and SpeedVersion......,...........d.............................,......................................'7........~-4 .
`Table 4-4: Memory
`Table 4.5: PC Card logic Levels .......................~................,..;..................................................'7...,.................4.7
`Table 4-6: Common MemorRaad. Function.tofa.UtyPesof Mem()I).:................. ...............,......??7...........,4--ie
`Table 4-7: Common MemoryWritaFuncion for SRA;EEPROMandSing!e.SuppI0f=lj"~hßli(lS..............4d16
`TableA-8:Atribute Memory Read Function..,.......:........ ..:.........."......... .,.............. .........,.,.., .......... .:..,.".......4-11
`Table.4-9: Attribute Memory Function.for$ìngleSuppIYS~~1'c:...EEPROM .... ,.. ...........,.......::..:......,.:........4.17..
`4.1 0: Wrie Protect Functíol'..................................................~...........................................,..-...........,....4.18
`Table
`Table 4-11: Common MenoryRead Timing Speíçationfor all ty~ottyamory ............... ..................... ...,.., .A-19
`Table 4.12: ('.ommon Memory WfiteTjini9~~.~Çjr¡çatjon SflAM~........... ......... .......... .... ................d..d....d.....(.4c-29
`Table 4.13: Attribute MemOry.Rea~Jimi(lgSP~klsuty of MemQI.. ,........... ...,......,.................4.21
`Table 4-14: Electrical Interfce....,............ ;.:..:.........d.................."................. ...................... .............................4.25
`Table 4.15: Battery Voltage' Detec ...... .............. ......................d.:............. .... "" ................ .................. ...............4-28
`up/Power-down Timing...................................?".............................................................o...4..?S
`Table 4-16: Power.
`Input Functn for..¡/pÇias..............,..~....7.."........................................,..............,...............4.31
`Table4-17: i/O
`Table 4-18: I/O Output Fun~iljftorl/QÇÇlrds.............,....,..d........,......,................................................."......A-31
`Table 4.19: i/O Read (Input)Timing~fJcífjcalíon1Q(f\I5VJloCards.......................................... ...,........"A-32
`T3bla4-20: VOWrite(Ouiput) Timing spejfcati?RfQrAllsVVR~rcls..d......;...................................;..........Ad3~
`Spaces ..........,...............................~.~.........,....................................................,......A-34
`Table
`4-21 : Card Memory
`Table 4-22: Card Configuration Regist6rs.............................,............................... ...........d...,'.............d.,....7......~-:J4
`Table 4.24: Card Configurcnion and Staus.. R~gisterorgan~atrp...................... .." ... ......,..,........ ~'. ........:.......4-35
`T able 4-23: Configura1ionOptionHegister. .......... ............... ......; ...... ...... .... .......... ....... ...,........,...,.. .., ................4-35
`Table 4-25: Pin Replacemènt Register Organizlllion..,........:..............................,..................................,..........4.36
`Table 4-26: Socket and Coy Register OrganizàtÎOjt...~.......;,....;.:..................................................................4-36
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`CARD.METAfORMAT
`Forat .. .................................,................................................. .............................................:....5.5
`Table 5-1: Tuple
`Table .5-2: Tupleçodes. .........................;...................................,.................. ...... ........................'.-.:..........._..,...5.7
`Table 5-3: The Null Control Tuple .........,..ò........................................................................................................5.9
`5-4: Long 1.io\o Tuple .......,..,.......,..,...,.;...............................,......................~................:,........;."..,..........:....;..5.9
`Table
`5-5: Link Targel Tuple ..................;;.................................................;;......ò...............................................5.1 0
`Table
`Table 5--: No.Unk Tuple...................................................;.......................;......................................................5-10
`Table .5-7: The End-of.Uôt.9RlltretTuple.... ...... .........:.......y............... ... ..._..............,.,.:._........:...:.....~...:............:...5-1()
`Table 5-8: Checksum Tuple ................................................;.......................................:..............:....:..............:5-11
`TableS,S: AlternateLanguageString. Tupla . ..... ..... ....... ..:........ ....... ....."... ........ .,........,., ...... '.....' ....~... . ..... ...:.~.... S..l?
`Table S-10: Device Information Tuples ...... ............. ................. ............, ~.. ..... ....................... ..... .....:...... ....... ...5.13
`5-11: Device ID......................................................................................................................................5-14
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`Table 5-12: Dé..ice Speed Codes .......................,..................,..i...................................;............................;....5~14
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` / Table §-13-Extended Device.Speed Codes.
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`Table8-48:Davice Size Byte...eo
`Tabie5-16:‘Lavel 4 Version / Product nformationTuple,
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`Table'5-17: The JEDEC Identifier Tuples........
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`". Tabie5-18:Olier Conditions Device InformationTp.deeee.
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`, Table5-49:.Other ConditionsInformation Field ..
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`-Table8-198: PC Gard Functions...ce
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`Table5-19b< System Initialization ‘Bytepencesssupesensderaueaeesenseneees
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`‘Table5-190: TPLFE_TYPE. Extension Tupie Type Codes...
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`196° TPLFE_UA: UART Identification Field...
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`7 Tabie5-191 TPLFE_UG: UARTCapabilities Fietd ...
`Tabta §-19g: Moderniniarface Furiétion Extension‘Fuple ,
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`Table 5:49h: TPLFE_FC; Flow.Control Methods:..:
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`Table5:biTPLFE_ aM: CommandProtocols.
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`“Table 5-19y: TPLEE..FM CONTModulationStaridards ..
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`Table5-192: TPLFEFY Standardized DateEneryption.....
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`Table5-19aa: TPLFE_FSDocumentFacsimile FeatureSelect
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`Table.5-19ab: TPLFE_CF CCHT Country.Code :
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`|. \ Table 5-19a¢!VoiceFunctionExtension Tuple.........
`“Tabla 5-19ad: TPLFE_TYPE Type ofCISTPL..PUNCE
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`’ Table6-19ae: TPLFE_UV: UAATinterface Field
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`Table5-19af TPLFE.SR: Sample. fateField...
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`_. Table.5-t9ag: TPLFE_SS: SampleSize Field...
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`- “Fable 5-19ah:TPLFE_SC: Voice.Compressionfethods..
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`Fable §-20% Configuration Tuple..eas
`Table 5-21: Size of Fields Byte....... .
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`Tabla 5-22: GardConfiguration andLastEntry index:wueleuss
`Table §-23: Configuration Registers:Base AddréssinREG Space .......
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`"Fable 5-24: Configuration RegisterPresenceMaskFietd for. Interface Tupte
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`” Table 5-25: Custonrinterlace Subtuples:
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`Table 5-26: Configuration Table:Eniry Tuple::
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`Table 5-27; Configuration: index Byte...
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`.Table5-28: Entry InterfaceDescription
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`- Fable'5-29:
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`Power Description.Structure Parameter‘Definitions
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`‘Table5-33: Power Description Example...
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`° .. Table'5-34:Configuration Timing Information..
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`‘Table 5-35:.1/O Space Addresses Required.ForContiiguration.
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`Table 5-36: 8/16 Bit Bus Widtly Description../.......
`Table 5-37: Length and Size FOS oy ooccceeecee.
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`Contents
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`CLEVELAND PUBLIC LIB
`LIST OF TABLES SCIENCE & TECHNOLoGY ~i:~.
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`PCMCIA PC CARD STANDARD
`Release 2.1
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`List o~ Tables .......................................................................................~~~..~.~...lss,4..........................Ix '
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`1. GENERAL
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`I I
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`I (t
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`1.1 Introduction ........................................................................................................................................1-3
`1.2 Relationship to Other Standard-5etng Bodies ..............................................................................1-3
`1.3 History .................................................................................................................................................1-3
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`1.4 Standardization Goals ....................._................................................................................................1-3
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`1.5 Differences Between Release 1.0 and 2.0 ........................................................................................1-4
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`2. SCOPE
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`2.1 Elements of the Standard: Physical. Interface, Softare ........................