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TOSHIKI YABU MIZUKI SEGAWA

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SEMICONDUCTOR INTERCONNECT FORMED OVER AN INSULATION AND HAVING MOISTURE RESISTANT MATERIAL

09/387,834 | U.S. Patent Application

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Location FILE REPOSITORY (FRANCONIA)

Filed Sept. 1, 1999

Examiner FETSUM ABRAHAM

Class 257

Art Group 2826

Patent No. 6,232,656

Case Type Utility - 257/690000

Status Patented Case

Parent 08/925,442 Patented

Child 10/438,348 Patented

Child 11/984,551 Patented

Child 12/915,880 Abandoned

Child 8-239403

Last Updated: 2 years, 1 month ago

Date	#	Transaction
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SEMICONDUCTOR INTERCONNECT FORMED OVER AN INSULATION AND HAVING MOISTURE RESISTANT MATERIAL

09/387,834 | U.S. Patent Application

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