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Toshiki Yabu Mizuki Segawa

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SEMICONDUCTOR INTERCONNECT FORMED OVER AN INSULATION AND HAVING MOISTURE RESISTANT MATERIAL

10/438,348 | U.S. Patent Application

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Location ELECTRONIC

Filed May 15, 2003

Examiner EVAN T PERT

Class 257

Art Group 2826

Patent No. RE39932

Case Type Re-Issue - 257/690000

Status Patented Case

Parent 09/387,834 Patented

Parent 08/925,442 Patented

Child 11/984,551 Patented

Child 12/915,880 Abandoned

Child 8-239403

Last Updated: 4 years, 8 months ago

Date	#	Transaction
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SEMICONDUCTOR INTERCONNECT FORMED OVER AN INSULATION AND HAVING MOISTURE RESISTANT MATERIAL

10/438,348 | U.S. Patent Application

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