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METHOD AND APPARATUS FOR PLASMA DICING A SEMI-CONDUCTOR WAFER

13/764,110 | U.S. Patent Application

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Location ELECTRONIC
Filed Feb. 11, 2013
Examiner ERIK T PETERSON
Class 438
Art Group 2822
Patent No. 8,796,154
Case Type Utility - 438/731000
Status Patented Case
Parent 13/412,119 Patented
Parent 61/452,450 Expired
Last Updated: 1 year, 3 months ago
Date # Transaction