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Displaying 24-38 of
43 results
1002 Exhibit: Prosecution File History of US Patent No 9,431,368
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IPR2019-00007, No. 1002-2 Exhibit - Prosecution File History of US Patent No 9,431,368 (P.T.A.B. Oct. 1, 2018)
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1006 Exhibit: US Patent No 6,097,096, Metal Attachment Method andStructure for ...
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IPR2019-00007, No. 1006-6 Exhibit - US Patent No 6,097,096, Metal Attachment Method andStructure for Attaching Substrates at Low Temperatures filedJul 11, 1997 Gardner (P.T.A.B. Oct. 1, ...
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1008 Exhibit: Q Y Tong et al, Semiconductor Wafer Bonding RecentDevelopments,...
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IPR2019-00007, No. 1008-8 Exhibit - Q Y Tong et al, Semiconductor Wafer Bonding RecentDevelopments, 37 Materials Chemistry and Physics 1011994 Tong (P.T.A.B. Oct. 1, 2018)
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1004 Exhibit: Curriculum Vitae for Dr Charles Hunt in Support of Petitionfor Inter Partes Review of US Patent No 9,431,368
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IPR2019-00007, No. 1004-4 Exhibit - Curriculum Vitae for Dr Charles Hunt in Support of Petitionfor Inter Partes Review of US Patent No 9,431,368 (P.T.A.B. Oct. 1, 2018)
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1003 Exhibit: Declaration of Dr Charles Hunt
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IPR2019-00007, No. 1003-3 Exhibit - Declaration of Dr Charles Hunt (P.T.A.B. Oct. 1, 2018)
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1007 Exhibit: US Patent No 5,413,952, Direct Wafer Bonded StructureMethod of M...
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IPR2019-00007, No. 1007-7 Exhibit - US Patent No 5,413,952, Direct Wafer Bonded StructureMethod of Making filed Feb 2, 1994 Pages (P.T.A.B. Oct. 1, 2018)
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1011 Exhibit: Declaration of Amanda Peil from Elsevier Inc RegardingExhibit 1008 ...
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IPR2019-00007, No. 1011-2 Exhibit - Declaration of Amanda Peil from Elsevier Inc RegardingExhibit 1008 Part 2 of 2 (P.T.A.B. Oct. 1, 2018)
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1011 Exhibit: Declaration of Amanda Peil from Elsevier Inc RegardingExhibit 1008 ...
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IPR2019-00007, No. 1011 Exhibit - Declaration of Amanda Peil from Elsevier Inc RegardingExhibit 1008 Part 1 of 2 (P.T.A.B. Oct. 1, 2018)
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1009 Exhibit: US Patent No 5,753,536, Semiconductor Device andAssociated Fabr...
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IPR2019-00007, No. 1009 Exhibit - US Patent No 5,753,536, Semiconductor Device andAssociated Fabrication Method filed Aug 28,1995Sugiyama (P.T.A.B. Oct. 1, 2018)
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1003 Exhibit: Declaration of Dr Charles Hunt
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IPR2019-00007, No. 1003 Exhibit - Declaration of Dr Charles Hunt (P.T.A.B. Oct. 1, 2018)
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1002 Exhibit: Prosecution File History of US Patent No 9,431,368
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IPR2019-00007, No. 1002 Exhibit - Prosecution File History of US Patent No 9,431,368 (P.T.A.B. Oct. 1, 2018)
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1012 Exhibit: John L Vossen et al, Thin Film Processes, Academic Press1978 exce...
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IPR2019-00007, No. 1012 Exhibit - John L Vossen et al, Thin Film Processes, Academic Press1978 excerpts (P.T.A.B. Oct. 1, 2018)
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1010 Exhibit: Q Y Tong et al, Semiconductor Wafer Bonding, Science andTechnolo...
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IPR2019-00007, No. 1010 Exhibit - Q Y Tong et al, Semiconductor Wafer Bonding, Science andTechnology, The Electrochemical Society Series 1999excerpts (P.T.A.B. Oct. 1, 2018)
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1013 Exhibit: John L Vossen et al, Thin Film Processes II, Academic Press1991 exc...
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IPR2019-00007, No. 1013 Exhibit - John L Vossen et al, Thin Film Processes II, Academic Press1991 excerpts (P.T.A.B. Oct. 1, 2018)
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1001 Exhibit: US Patent No 9,431,368 the 368 Patent
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IPR2019-00007, No. 1001 Exhibit - US Patent No 9,431,368 the 368 Patent (P.T.A.B. Oct. 1, 2018)
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