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1005 Exhibit: US Patent No 5,236,118, Aligned Wafer Bonding filed May12, 1992 B...

Document IPR2019-00007, No. 1005 Exhibit - US Patent No 5,236,118, Aligned Wafer Bonding filed May12, 1992 Bower (P.T.A.B. Oct. 1, 2018)

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1007 Exhibit: US Patent No 5,413,952, Direct Wafer Bonded StructureMethod of M...

Document IPR2019-00007, No. 1007 Exhibit - US Patent No 5,413,952, Direct Wafer Bonded StructureMethod of Making filed Feb 2, 1994 Pages (P.T.A.B. Oct. 1, 2018)

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1006 Exhibit: US Patent No 6,097,096, Metal Attachment Method andStructure for ...

Document IPR2019-00007, No. 1006 Exhibit - US Patent No 6,097,096, Metal Attachment Method andStructure for Attaching Substrates at Low Temperatures filedJul 11, 1997 Gardner (P.T.A.B. Oct. 1, 20...

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1008 Exhibit: Q Y Tong et al, Semiconductor Wafer Bonding RecentDevelopments,...

Document IPR2019-00007, No. 1008 Exhibit - Q Y Tong et al, Semiconductor Wafer Bonding RecentDevelopments, 37 Materials Chemistry and Physics 1011994 Tong (P.T.A.B. Oct. 1, 2018)

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1004 Exhibit: Curriculum Vitae for Dr Charles Hunt in Support of Petitionfor Inter Partes Review of US Patent No 9,431,368

Document IPR2019-00007, No. 1004 Exhibit - Curriculum Vitae for Dr Charles Hunt in Support of Petitionfor Inter Partes Review of US Patent No 9,431,368 (P.T.A.B. Oct. 1, 2018)

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