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Displaying 39-53 of
87 results
1009 Exhibit: Q Tong et al, Semiconductor Wafer Bonding RecentDevelopments, 3...
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IPR2019-00023, No. 1009-8 Exhibit - Q Tong et al, Semiconductor Wafer Bonding RecentDevelopments, 37 Materials Chemistry and Physics 1011994 Tong (P.T.A.B. Oct. 2, 2018)
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1007 Exhibit: M Reiche, The Effect of a Plasma Pretreatment on the SiSiBonding B...
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IPR2019-00023, No. 1007-7 Exhibit - M Reiche, The Effect of a Plasma Pretreatment on the SiSiBonding Behaviour, 97 36 Electrochemical SocietyProceedings 437 1998 Reiche (P.T.A.B. Oct. 2...
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1002 Exhibit: Prosecution File History of US Patent No 8,153,505
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IPR2019-00023, No. 1002-2 Exhibit - Prosecution File History of US Patent No 8,153,505 (P.T.A.B. Oct. 2, 2018)
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1022 Exhibit: Robert W Bower, Low temperature Si3N4 direct bonding, 62Appl Phys...
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IPR2019-00023, No. 1022-20 Exhibit - Robert W Bower, Low temperature Si3N4 direct bonding, 62Appl Phys Lett 26 1993 (P.T.A.B. Oct. 2, 2018)
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1010 Exhibit: Q Tong et al, Semiconductor Wafer Bonding Science andTechnology...
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IPR2019-00023, No. 1010-9 Exhibit - Q Tong et al, Semiconductor Wafer Bonding Science andTechnology, John Wiley Sons, Inc 1999 (P.T.A.B. Oct. 2, 2018)
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1003 Exhibit: Declaration of Dr Charles Hunt
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IPR2019-00023, No. 1003-3 Exhibit - Declaration of Dr Charles Hunt (P.T.A.B. Oct. 2, 2018)
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1021 Exhibit: Qin Yi Tong, Wafer Bonding and Layer Splitting forMicrosystems, 11 A...
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IPR2019-00023, No. 1021-19 Exhibit - Qin Yi Tong, Wafer Bonding and Layer Splitting forMicrosystems, 11 Adv Mater 17 1999 (P.T.A.B. Oct. 2, 2018)
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1014 Exhibit: Ricardo DAgostino, Plasma Etching of Si and SiO2 in SF6 O2 mixture...
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IPR2019-00023, No. 1014-13 Exhibit - Ricardo DAgostino, Plasma Etching of Si and SiO2 in SF6 O2 mixtures, 521 J Appl Phys 162 1981 (P.T.A.B. Oct. 2, 2018)
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1020 Exhibit: Yang Li, Systematic Low Temperature Bonding and ItsApplication To...
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IPR2019-00023, No. 1020-18 Exhibit - Yang Li, Systematic Low Temperature Bonding and ItsApplication To The Hydrogen Ion Cut Process And Three Dimensional Structures, University of Califo...
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1011 Exhibit: Johann Steinkirchner et al, Silicon Wafer Bonding viaDesigned Mono...
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IPR2019-00023, No. 1011-10 Exhibit - Johann Steinkirchner et al, Silicon Wafer Bonding viaDesigned Monolayers, 7 Advanced Materials 7, 662 1995 (P.T.A.B. Oct. 2, 2018)
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1013 Exhibit: John L Vossen et al, Thin Film Processes II, AcademicPress 1991 exc...
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IPR2019-00023, No. 1013-12 Exhibit - John L Vossen et al, Thin Film Processes II, AcademicPress 1991 excerpts (P.T.A.B. Oct. 2, 2018)
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1016 Exhibit: Elsevier Declaration Regarding Tong Ex 1009 Part 2 of 2
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IPR2019-00023, No. 1016-15 Exhibit - Elsevier Declaration Regarding Tong Ex 1009 Part 2 of 2 (P.T.A.B. Oct. 2, 2018)
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1001 Exhibit: US Patent No 8,153,505 the 505 Patent
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IPR2019-00023, No. 1001 Exhibit - US Patent No 8,153,505 the 505 Patent (P.T.A.B. Oct. 2, 2018)
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1015 Exhibit: Japan Patent Appl Laid Open Pub No H7 249749, Methodof Manufac...
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IPR2019-00022, No. 1015-11 Exhibit - Japan Patent Appl Laid Open Pub No H7 249749, Methodof Manufacturing SOI Substrate Sept 26, 1995Yamagata (P.T.A.B. Oct. 2, 2018)
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1004 Exhibit: Curriculum Vitae for Dr Charles Hunt
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IPR2019-00022, No. 1004-4 Exhibit - Curriculum Vitae for Dr Charles Hunt (P.T.A.B. Oct. 2, 2018)
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