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Displaying 69-83 of
87 results
1016 Exhibit: Elsevier Declaration regarding Tong Ex 1009 Part 2 of 2
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IPR2019-00022, No. 1016 Exhibit - Elsevier Declaration regarding Tong Ex 1009 Part 2 of 2 (P.T.A.B. Oct. 2, 2018)
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1010 Exhibit: Q Tong et al, Semiconductor Wafer Bonding Science andTechnology...
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IPR2019-00022, No. 1010 Exhibit - Q Tong et al, Semiconductor Wafer Bonding Science andTechnology, John Wiley Sons, Inc 1999 (P.T.A.B. Oct. 2, 2018)
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1026 Exhibit: Hall Ellis Declaration
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IPR2019-00022, No. 1026 Exhibit - Hall Ellis Declaration (P.T.A.B. Oct. 2, 2018)
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1016 Exhibit: Elsevier Declaration regarding Tong Ex 1009 Part 1 of 2
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IPR2019-00022, No. 1016-2 Exhibit - Elsevier Declaration regarding Tong Ex 1009 Part 1 of 2 (P.T.A.B. Oct. 2, 2018)
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1021 Exhibit: Qin Yi Tong, Wafer Bonding and Layer Splitting forMicrosystems, 11 A...
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IPR2019-00022, No. 1021 Exhibit - Qin Yi Tong, Wafer Bonding and Layer Splitting forMicrosystems, 11 Adv Mater 17, 1409 1999 (P.T.A.B. Oct. 2, 2018)
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1009 Exhibit: Q Tong et al, Semiconductor Wafer Bonding RecentDevelopments, 3...
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IPR2019-00022, No. 1009 Exhibit - Q Tong et al, Semiconductor Wafer Bonding RecentDevelopments, 37 Materials Chemistry and Physics 1011994 Tong (P.T.A.B. Oct. 2, 2018)
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1022 Exhibit: Robert W Bower, Low temperature Si3N4 direct bonding, 62Appl Phys...
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IPR2019-00022, No. 1022 Exhibit - Robert W Bower, Low temperature Si3N4 direct bonding, 62Appl Phys Lett 26, 3485 1993 (P.T.A.B. Oct. 2, 2018)
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1001 Exhibit: US Patent No 8,153,505 the 505 Patent
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IPR2019-00022, No. 1001 Exhibit - US Patent No 8,153,505 the 505 Patent (P.T.A.B. Oct. 2, 2018)
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1019 Exhibit: US Patent No 5,503,704, Nitrogen Based Low TemperatureDirect Bon...
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IPR2019-00022, No. 1019 Exhibit - US Patent No 5,503,704, Nitrogen Based Low TemperatureDirect Bonding filed 1994 Bower (P.T.A.B. Oct. 2, 2018)
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1013 Exhibit: John L Vossen et al, Thin Film Processes II, AcademicPress 1991 exc...
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IPR2019-00022, No. 1013 Exhibit - John L Vossen et al, Thin Film Processes II, AcademicPress 1991 excerpts (P.T.A.B. Oct. 2, 2018)
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1011 Exhibit: Johann Steinkirchner et al, Silicon Wafer Bonding viaDesigned Mono...
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IPR2019-00022, No. 1011 Exhibit - Johann Steinkirchner et al, Silicon Wafer Bonding viaDesigned Monolayers, 7 Advanced Materials 7, 662 1995 (P.T.A.B. Oct. 2, 2018)
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1012 Exhibit: John L Vossen et al, Thin Film Processes, Academic Press1978 exce...
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IPR2019-00022, No. 1012 Exhibit - John L Vossen et al, Thin Film Processes, Academic Press1978 excerpts (P.T.A.B. Oct. 2, 2018)
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1020 Exhibit: Yang Li, Systematic Low Temperature Bonding and ItsApplication To...
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IPR2019-00022, No. 1020 Exhibit - Yang Li, Systematic Low Temperature Bonding and ItsApplication To The Hydrogen Ion Cut Process And Three Dimensional Structures, University of Californi...
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1015 Exhibit: Japan Patent Appl Laid Open Pub No H7 249749, Methodof Manufac...
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IPR2019-00022, No. 1015 Exhibit - Japan Patent Appl Laid Open Pub No H7 249749, Methodof Manufacturing SOI Substrate Sept 26, 1995Yamagata (P.T.A.B. Oct. 2, 2018)
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1002 Exhibit: Prosecution File History of US Patent No 8,153,505
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IPR2019-00022, No. 1002 Exhibit - Prosecution File History of US Patent No 8,153,505 (P.T.A.B. Oct. 2, 2018)
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