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Displaying 54-68 of
87 results
1002 Exhibit: Prosecution File History of US Patent No 8,153,505
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IPR2019-00022, No. 1002-2 Exhibit - Prosecution File History of US Patent No 8,153,505 (P.T.A.B. Oct. 2, 2018)
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1026 Exhibit: Hall Ellis Declaration
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IPR2019-00022, No. 1026-18 Exhibit - Hall Ellis Declaration (P.T.A.B. Oct. 2, 2018)
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1020 Exhibit: Yang Li, Systematic Low Temperature Bonding and ItsApplication To...
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IPR2019-00022, No. 1020-15 Exhibit - Yang Li, Systematic Low Temperature Bonding and ItsApplication To The Hydrogen Ion Cut Process And Three Dimensional Structures, University of Califo...
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1012 Exhibit: John L Vossen et al, Thin Film Processes, Academic Press1978 exce...
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IPR2019-00022, No. 1012-9 Exhibit - John L Vossen et al, Thin Film Processes, Academic Press1978 excerpts (P.T.A.B. Oct. 2, 2018)
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1021 Exhibit: Qin Yi Tong, Wafer Bonding and Layer Splitting forMicrosystems, 11 A...
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IPR2019-00022, No. 1021-16 Exhibit - Qin Yi Tong, Wafer Bonding and Layer Splitting forMicrosystems, 11 Adv Mater 17, 1409 1999 (P.T.A.B. Oct. 2, 2018)
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1016 Exhibit: Elsevier Declaration regarding Tong Ex 1009 Part 1 of 2
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IPR2019-00022, No. 1016-12 Exhibit - Elsevier Declaration regarding Tong Ex 1009 Part 1 of 2 (P.T.A.B. Oct. 2, 2018)
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1011 Exhibit: Johann Steinkirchner et al, Silicon Wafer Bonding viaDesigned Mono...
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IPR2019-00022, No. 1011-8 Exhibit - Johann Steinkirchner et al, Silicon Wafer Bonding viaDesigned Monolayers, 7 Advanced Materials 7, 662 1995 (P.T.A.B. Oct. 2, 2018)
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1005 Exhibit: C Harendt, Vertical Polysilicon Interconnects by AlignedWafer Bondin...
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IPR2019-00022, No. 1005-5 Exhibit - C Harendt, Vertical Polysilicon Interconnects by AlignedWafer Bonding, 97 36 Electrochemical Society Proceedings501 1998 Harendt (P.T.A.B. Oct. 2, 2018...
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1019 Exhibit: US Patent No 5,503,704, Nitrogen Based Low TemperatureDirect Bon...
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IPR2019-00022, No. 1019-14 Exhibit - US Patent No 5,503,704, Nitrogen Based Low TemperatureDirect Bonding filed 1994 Bower (P.T.A.B. Oct. 2, 2018)
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1013 Exhibit: John L Vossen et al, Thin Film Processes II, AcademicPress 1991 exc...
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IPR2019-00022, No. 1013-10 Exhibit - John L Vossen et al, Thin Film Processes II, AcademicPress 1991 excerpts (P.T.A.B. Oct. 2, 2018)
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1010 Exhibit: Q Tong et al, Semiconductor Wafer Bonding Science andTechnology...
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IPR2019-00022, No. 1010-7 Exhibit - Q Tong et al, Semiconductor Wafer Bonding Science andTechnology, John Wiley Sons, Inc 1999 (P.T.A.B. Oct. 2, 2018)
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1022 Exhibit: Robert W Bower, Low temperature Si3N4 direct bonding, 62Appl Phys...
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IPR2019-00022, No. 1022-17 Exhibit - Robert W Bower, Low temperature Si3N4 direct bonding, 62Appl Phys Lett 26, 3485 1993 (P.T.A.B. Oct. 2, 2018)
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1009 Exhibit: Q Tong et al, Semiconductor Wafer Bonding RecentDevelopments, 3...
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IPR2019-00022, No. 1009-6 Exhibit - Q Tong et al, Semiconductor Wafer Bonding RecentDevelopments, 37 Materials Chemistry and Physics 1011994 Tong (P.T.A.B. Oct. 2, 2018)
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1003 Exhibit: Declaration of Dr Charles Hunt
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IPR2019-00022, No. 1003-3 Exhibit - Declaration of Dr Charles Hunt (P.T.A.B. Oct. 2, 2018)
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1016 Exhibit: Elsevier Declaration regarding Tong Ex 1009 Part 2 of 2
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IPR2019-00022, No. 1016-13 Exhibit - Elsevier Declaration regarding Tong Ex 1009 Part 2 of 2 (P.T.A.B. Oct. 2, 2018)
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