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INVENSAS BONDING TECHNOLOGIES, INC. v. SAMSUNG ELECTRONICS AMER...
Docket
2:17-cv-07609,
New Jersey District Court
(Sept. 28, 2017)
Judge Renee Marie Bumb,
presiding,
Magistrate Judge Karen M. Williams
Patent
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Samsung Electronics Co., Ltd. v. Invensas Bonding Technologies, Inc.
Docket
IPR2019-00007,
Patent Trial and Appeal Board
(Oct. 1, 2018)
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No. 41
Document
INVENSAS BONDING TECHNOLOGIES, INC. v. SAMSUNG ELECTRONICS AMERICA, INC. et al, 2:17-cv-07609, No. 41 (D.N.J. Sep. 12, 2018)
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12 Refund Approval: Notice of Refund
Document
IPR2019-00007, No. 12 Refund Approval - Notice of Refund (P.T.A.B. Feb. 1, 2019)
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10 Termination Decision Document: Termination Decision Document
Document
IPR2019-00007, No. 10 Termination Decision Document - Termination Decision Document (P.T.A.B. Dec. 21, 2018)
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7 Notice of Filing Date Accorded to Petition: Notice of Accord Filing Date
Document
IPR2019-00007, No. 7 Notice of Filing Date Accorded to Petition - Notice of Accord Filing Date (P.T.A.B. Dec. 3, 2018)
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No. 1
Document
INVENSAS BONDING TECHNOLOGIES, INC. v. SAMSUNG ELECTRONICS AMERICA, INC. et al, 2:17-cv-07609, No. 1 (D.N.J. Sep. 28, 2017)
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8 Motion: Joint Motion to Terminate Proceeding Pursuant to 35 USC 317 and 37 CF...
Document
IPR2019-00007, No. 8 Motion - Joint Motion to Terminate Proceeding Pursuant to 35 USC 317 and 37 CFR 4274 (P.T.A.B. Dec. 13, 2018)
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