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METHOD AND APPARATUS FOR PLASMA DICING A SEMI-CONDUCTOR WAFER

16/132,040 | U.S. Patent Application

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Location ELECTRONIC
Filed Sept. 14, 2018
Examiner ERIK T PETERSON
Class 438
Art Group 2822
Case Type Utility - 438/460000
Status Notice of Allowance Mailed -- Application Received in Office of Publications
Parent 14/842,365 Patented
Parent 13/764,177 Patented
Parent 13/412,119 Patented
Parent 61/452,450 Expired
Last Updated: 5 years, 8 months ago
Date # Transaction