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METHOD AND APPARATUS FOR PLASMA DICING A SEMI-CONDUCTOR WAFER

13/412,119 | U.S. Patent Application

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Location ELECTRONIC

Filed March 5, 2012

Examiner ERIK T PETERSON

Class 438

Art Group 2822

Patent No. 8,802,545

Case Type Utility - 438/460000

Status Patented Case

Parent 61/452,450 Expired

Child 13/448,769 Patented

Child 13/764,110 Patented

Child 13/764,142 Patented

Child 13/764,160 Patented

Child 13/764,177 Patented

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Last Updated: 3 years, 11 months ago

Date	#	Transaction
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METHOD AND APPARATUS FOR PLASMA DICING A SEMI-CONDUCTOR WAFER

13/412,119 | U.S. Patent Application

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